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- [21] Effects of electromigration on IMC evolution in Pb-free solder joints 2004 INTERNATIONAL CONFERENCE ON THE BUSINESS OF ELECTRONIC PRODUCT RELIABILITY AND LIABILITY, PROCEEDINGS, 2004, : 47 - 49
- [23] Mechanical fatigue of Sn-rich Pb-free solder alloys Journal of Materials Science: Materials in Electronics, 2007, 18 : 211 - 227
- [24] Fatigue Failure Processes in Pb-free Solder Joints using Continuum Damage and Cohesive Zone Models PROCEEDINGS OF THE 2012 IEEE 14TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2012, : 456 - 461
- [25] Bend fatigue reliability test and analysis for Pb-free solder joint PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2, 2005, : 868 - 872
- [27] Wetting characteristics of Pb-free solder pastes and Pb-free PWB finishes 51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 1338 - 1344
- [29] Vibration fatigue reliability of BGA-IC package with pb-free solder and Pb-Sn solder 53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 891 - 897
- [30] Recrystallization and Precipitate Coarsening in Pb-Free Solder Joints During Thermomechanical Fatigue Journal of Electronic Materials, 2012, 41 : 241 - 252