A MECHANICAL FATIGUE DAMAGE EVOLUTION MODEL FOR PB-FREE SOLDER MATERIALS

被引:0
|
作者
Ladani, Leila J. [1 ]
Razmi, Jafar [1 ]
机构
[1] Utah State Univ, Dept Mech & Aerosp Engn, Logan, UT 84322 USA
关键词
Continuum damage mechanics solder; micro-electronics; cyclic fatigue; CONSTITUTIVE MODEL; 63SN37PB SOLDER; TIME;
D O I
暂无
中图分类号
TH [机械、仪表工业];
学科分类号
0802 ;
摘要
Evaluating state of damage in a ductile material as it experiences mechanical fatigue and cyclic loading poses much complexity and has been the subject of many researches. This study revisits the anisotropic damage model developed by Lemaitre (1992) and proposes to use his model combined with a micro-mechanics and mechanism based damage evolution model (Energy Partitioning Damage Evolution (EPDE)) and also a Unified Creep Plasticity-based model to predict the state of damage. The model is examined for pure shear and is applied to Pb-free solder materials. New anisotropic damage model exponents are generated using experimental data for Pb-free solder for both EPDE and UPC-based models and are compared with exponents generated previously under the assumption of isotropic and homogenous damage evolution.
引用
收藏
页码:603 / 609
页数:7
相关论文
共 50 条
  • [1] An anisotropic mechanical fatigue damage evolution model for Pb-free solder materials
    Ladani, Leila J.
    Razmi, Jafar
    MECHANICS OF MATERIALS, 2009, 41 (07) : 878 - 885
  • [2] Partitioned cyclic fatigue damage evolution model for Pb-free solder materials
    Ladani, Leila J.
    Dasgupta, A.
    PROCEEDINGS OF THE ASME PRESSURE VESSELS AND PIPING CONFERENCE 2007, VOL 9, 2008, : 119 - 125
  • [3] Microstructure evolution in a Pb-free solder alloy during mechanical fatigue
    Matin, M. A.
    Vellinga, W. P.
    Geers, M. G. D.
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2006, 431 (1-2): : 166 - 174
  • [4] DAMAGE INITIATION AND PROPAGATION MODELING USING ENERGY PARTITIONING DAMAGE EVOLUTION MODEL FOR PB-FREE SOLDER MATERIALS
    Ladani, Leila J.
    2010 12TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, 2010,
  • [5] Continuum Damage Evolution in Pb-Free Solder Joint under Shear Fatigue Loadings
    Shaffiar, N. M.
    Loh, W. K.
    Kamsah, N.
    Tamin, M. N.
    2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 304 - 308
  • [6] Mechanical fatigue of Sn-rich Pb-free solder alloys
    Shang, J. K.
    Zeng, Q. L.
    Zhang, L.
    Zhu, Q. S.
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2007, 18 (1-3) : 211 - 227
  • [7] Mechanical fatigue of Sn-rich Pb-free solder alloys
    J. K. Shang
    Q. L. Zeng
    L. Zhang
    Q. S. Zhu
    Journal of Materials Science: Materials in Electronics, 2007, 18 : 211 - 227
  • [8] UCPD Model for Pb-Free Solder
    Neilsen, Michael K.
    Vianco, Paul T.
    JOURNAL OF ELECTRONIC PACKAGING, 2014, 136 (04)
  • [9] Effect of Microstructure Evolution on Pb-free Solder Joint Reliability in Thermomechanical Fatigue
    Yin, Liang
    Meilunas, Michael
    Arfaei, Babak
    Wentlent, Luke
    Borgesen, Peter
    2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, : 493 - 499
  • [10] Microstructural evolution in Pb-free solder microjoints
    Morris, JW
    Song, HG
    Kim, YH
    PRICM 4: FORTH PACIFIC RIM INTERNATIONAL CONFERENCE ON ADVANCED MATERIALS AND PROCESSING, VOLS I AND II, 2001, : 1075 - 1078