Comparative Study of Crosstalk Noise Due to Inductive Links on Heterogeneous 3-D ICs

被引：0
|
作者：
Papistas, Ioannis A. [1 ]
Pavlidis, Vasilis F. [1 ]
机构：
[1] Univ Manchester, Sch Comp Sci, Adv Processor Technol Grp, Manchester, Lancs, England
来源：
2017 IEEE MTT-S INTERNATIONAL CONFERENCE ON NUMERICAL ELECTROMAGNETIC AND MULTIPHYSICS MODELING AND OPTIMIZATION FOR RF, MICROWAVE, AND TERAHERTZ APPLICATIONS (NEMO) | 2017年
基金：
英国工程与自然科学研究理事会;
关键词：
HIGH-DENSITY;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Inductive links have been proposed as an intertier interconnect solution for three-dimensional (3-D) integrated systems. Combined with signal multiplexing, inductive links achieve high communication bandwidth comparable to that of through silicon vias. However, being a wireless medium, electromagnetic coupling between the inductive link and nearby on-chip interconnects can cause voltage fluctuations affecting interconnect performance. Signal interference from adjacent interconnects on the operation of inductive links has empirically been investigated. Nevertheless, the reverse problem has yet to be fully explored. Consequently, this paper investigates the effect of electromagnetic coupling on the global interconnects of the power delivery network in the vicinity of on-chip inductors for disparate technologies in a heterogeneous 3-D SiP.
引用
收藏
页码：314 / 316
页数：3
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