Indium Addition on Intermetallic Compound Evolution in Tin-Silver Solder Bump

被引：6

作者：

Wang, Dongliang ^{[1
,2
]}

Yuan, Yuan ^{[1
]}

Luo, Le ^{[1
]}

机构：

[1] Chinese Acad Sci, Shanghai Inst Microsyst & Informat Technol, State Key Lab Transducer Technol, Shanghai 200050, Peoples R China

[2] Chinese Acad Sci, Grad Sch, Beijing 100049, Peoples R China

来源：

MATERIALS TRANSACTIONS | 2011年 / 52卷 / 07期

关键词：

indium addition; undercooling; intermetallic compound; LEAD-FREE SOLDERS; AG-CU ALLOYS; AG3SN; SOLIDIFICATION; ZN;

D O I：

10.2320/matertrans.M2011058

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The formation of large Ag3Sn plate in Sn-Ag solder joint has restricted its application in lead-free electronic industry. There is a great interest for finding new approach to suppress the growth of Ag3Sn. In this paper, Sn-2.1Ag and Sn-1.8Ag-9.4In solder bumps are prepared by electroplating of Sn-Ag and indium in sequence. After reflow at 260 degrees C for 30 min with cooling rate 0.33 degrees C/s, the phase composition, microstructure and undercooling of solder alloys are characterized by X-ray diffraction, Scanning electron microscopy and Differential scanning calorimeter, respectively. It is found that after indium addition, large Ag3Sn plate is substituted by Ag9In4 with irregular polygon morphology. It is also found that indium addition can significantly reduce the undercooling of beta-Sn, which promotes the solidification of beta-Sn and inhibits the growth of Ag9In4 during slow cooling. [doi:10.2320/matertrans.M2011058]

引用

页码：1522 / 1524

页数：3

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