Interfacial intermetallic compound growth and shear strength of low-silver SnAgCuBiNi/Cu lead-free solder joints

被引：6
|
作者：
Wei, Guo-qiang [1 ]
Wang, Lei [1 ]
Peng, Xin-qiang [1 ]
Xue, Ming-yang [1 ]
机构：
[1] S China Univ Technol, Sch Mech & Automot Engn, Guangzhou 510640, Guangdong, Peoples R China
来源：
INTERNATIONAL JOURNAL OF MINERALS METALLURGY AND MATERIALS | 2013年 / 20卷 / 09期
基金：
中国国家自然科学基金;
关键词：
soldering alloys; soldered joints; aging; intermetallics; activation energy; shear strength; SN-AG-CU; COMPOSITE SOLDER; SN-3.0AG-0.5CU; ALLOYS; TIN; NI;
D O I：
10.1007/s12613-013-0810-8
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
The growth rule of the interfacial intermetallic compound (IMC) and the degradation of shear strength of Sn-0.8Ag-0.5Cu-2.0Bi-0.05Ni (SACBN)/Cu solder joints were investigated in comparison with Sn-3.0Ag-0.5Cu (SAC305)/Cu solder joints aging at 373, 403, and 438 K. The results show that (Cu1-x ,Ni (x) )(6)Sn-5 phase forms between the SACBN solder and Cu substrate during soldering. The interfacial IMC thickens constantly with the aging time increasing, and the higher the aging temperature, the faster the IMC layer grows. Compared with the SAC305/Cu couple, the SACBN/Cu couple exhibits a lower layer growth coefficient. The activation energies of IMC growth for SACBN/Cu and SAC305/Cu couples are 111.70 and 82.35 kJ/mol, respectively. In general, the shear strength of aged solder joints declines continuously. However, SACBN/Cu solder joints exhibit a better shear strength than SAC305/Cu solder joints.
引用
收藏
页码：883 / 889
页数：7
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