Interfacial intermetallic compound growth and shear strength of low-silver SnAgCuBiNi/Cu lead-free solder joints

被引：6

作者：

Wei, Guo-qiang ^{[1
]}

Wang, Lei ^{[1
]}

Peng, Xin-qiang ^{[1
]}

Xue, Ming-yang ^{[1
]}

机构：

[1] S China Univ Technol, Sch Mech & Automot Engn, Guangzhou 510640, Guangdong, Peoples R China

来源：

INTERNATIONAL JOURNAL OF MINERALS METALLURGY AND MATERIALS | 2013年 / 20卷 / 09期

基金：

中国国家自然科学基金;

关键词：

soldering alloys; soldered joints; aging; intermetallics; activation energy; shear strength; SN-AG-CU; COMPOSITE SOLDER; SN-3.0AG-0.5CU; ALLOYS; TIN; NI;

D O I：

10.1007/s12613-013-0810-8

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The growth rule of the interfacial intermetallic compound (IMC) and the degradation of shear strength of Sn-0.8Ag-0.5Cu-2.0Bi-0.05Ni (SACBN)/Cu solder joints were investigated in comparison with Sn-3.0Ag-0.5Cu (SAC305)/Cu solder joints aging at 373, 403, and 438 K. The results show that (Cu1-x ,Ni (x) )(6)Sn-5 phase forms between the SACBN solder and Cu substrate during soldering. The interfacial IMC thickens constantly with the aging time increasing, and the higher the aging temperature, the faster the IMC layer grows. Compared with the SAC305/Cu couple, the SACBN/Cu couple exhibits a lower layer growth coefficient. The activation energies of IMC growth for SACBN/Cu and SAC305/Cu couples are 111.70 and 82.35 kJ/mol, respectively. In general, the shear strength of aged solder joints declines continuously. However, SACBN/Cu solder joints exhibit a better shear strength than SAC305/Cu solder joints.

引用

页码：883 / 889

页数：7

共 50 条

[31] Effects of Mn, Zn on the Microstructure & Mechanical Properties of Low-Silver Sn-Ag-Cu Lead-Free Solder Joint
Zhang Fuwen
Zhang Qunchao
Hu Qiang
Zhu Xuexin
RARE METAL MATERIALS AND ENGINEERING, 2014, 43 (03) : 655 - 659
[32] Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging
Ming-yue Xiong
Liang Zhang
Journal of Materials Science, 2019, 54 : 1741 - 1768
[33] Interface reaction and intermetallic compound growth behavior of Sn-Ag-Cu lead-free solder joints on different substrates in electronic packaging
Xiong, Ming-yue
Zhang, Liang
JOURNAL OF MATERIALS SCIENCE, 2019, 54 (02) : 1741 - 1768
[34] Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints
An, Tong
Qin, Fei
JOURNAL OF ELECTRONIC PACKAGING, 2016, 138 (01)
[35] Growth and shear strength of intermetallic compounds in Sn-Ag-Cu solder joints
Zhu, Jiandong
Wang, Chunqing
Hang, Chunjin
Tian, Yanhong
2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 40 - 43
[36] Interfacial reactions and drop reliabilities of lead-free solder joints with electrolytic Cu metallizations
Jee, Young Kun
Kim, Jong Yeon
Yu, Jin
Lee, Taek Yeong
2007 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, 2007, : 425 - +
[37] Impact of Ni concentration on. the intermetallic compound formation and brittle fracture strength of Sn-Cu-Ni (SCN) lead-free solder joints
Yang, Chaoran
Song, Fubin
Lee, S. W. Ricky
MICROELECTRONICS RELIABILITY, 2014, 54 (02) : 435 - 446
[38] Effect of rare earth addition on shear strength of SnAgCu lead-free solder joints
Li, Guangdong
Shi, Yaowu
Hao, Hu
Xia, Zhidong
Lei, Yongping
Guo, Fu
Li, Xiaoyan
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2009, 20 (02) : 186 - 192
[39] Effect of rare earth addition on shear strength of SnAgCu lead-free solder joints
Guangdong Li
Yaowu Shi
Hu Hao
Zhidong Xia
Yongping Lei
Fu Guo
Xiaoyan Li
Journal of Materials Science: Materials in Electronics, 2009, 20 : 186 - 192
[40] Effects of intermetallic compounds on the properties of Sn-Ag-Cu lead-free solder joints
College of Materials Science and Engineering, Jilin University, Changchun 130022, China
Jilin Daxue Xuebao (Gongxueban), 2006, 6 (846-850):

← 1 2 3 4 5 →