Phase Change Memory: Device scaling and challenges for material engineering in the GeSbTe compound system

被引:9
|
作者
Boniardi, Mattia [1 ]
Redaelli, Andrea [1 ]
机构
[1] Micron Semicond Italia Srl, I-20864 Agrate Brianza, MB, Italy
关键词
Phase Change Memory; Scaling; Material engineering; GE-SB-TE; DIAGRAM;
D O I
10.1016/j.mee.2014.09.021
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The Phase Change Memory (PCM) relies on the peculiar properties of a chalcogenide material, able to be reversibly switched between two stable states, namely an amorphous phase, characterized by high electrical resistivity, and a poly-crystalline one, featuring low resistivity. The former is associated to the RESET state of the memory and the latter represents the SET state, thus enabling the storage of digital data. On one hand PCM device scaling is an important step in order to enable denser and low power applications, thanks to the shrink of dimensions and to the reduction of the operating power. On the other hand material engineering may represent a breakthrough in terms of reliability and performance enhancement, owing to the exploitation of the physical and chemical features of different phase change compounds. A smart combination of scaling and material engineering may result into wider application spectrum for PCM. (C) 2014 Elsevier B.V. All rights reserved.
引用
收藏
页码:1 / 4
页数:4
相关论文
共 50 条
  • [1] An engineering model for high-speed switching in GeSbTe phase-change memory
    Tominaga, Junji
    APPLIED PHYSICS EXPRESS, 2022, 15 (02)
  • [2] Constraints and resolution for phase change materials and memory device scaling
    Hong Yang
    Lin Yinyin
    Ling Yun
    Lai Lianzhang
    Feng Jie
    Lai Yunfeng
    Qiao Baowei
    Tang Tingao
    Cai Bingchu
    Chen Bomy
    INTEGRATED FERROELECTRICS, 2006, 78 (153-163) : 153 - 163
  • [3] Phase-Change Memory by GeSbTe Electrodeposition in Crossbar Arrays
    Noori, Yasir J.
    Meng, Lingcong
    Jaafar, Ayoub H.
    Zhang, Wenjian
    Kissling, Gabriela P.
    Han, Yisong
    Abdelazim, Nema
    Alibouri, Mehrdad
    LeBlanc, Kathleen
    Zhelev, Nikolay
    Huang, Ruomeng
    Beanland, Richard
    Smith, David C.
    Reid, Gillian
    de Groot, Kees
    Bartlett, Philip N.
    ACS APPLIED ELECTRONIC MATERIALS, 2021, 3 (08) : 3610 - 3618
  • [4] Nature of gap states in GeSbTe phase change memory materials
    Yu, X.
    Robertson, J.
    CANADIAN JOURNAL OF PHYSICS, 2014, 92 (7-8) : 671 - 674
  • [5] Phase change memory modeling: From chalcogenide physics to device scaling
    Ielmini, Daniele
    CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE 2012 (CSTIC 2012), 2012, 44 (01): : 1227 - 1234
  • [6] Driving forces for elemental demixing of GeSbTe in phase-change memory: Computational study to design a durable device
    Yang, Tae-Youl
    Cho, Ju-Young
    Park, Yong-Jin
    Joo, Young-Chang
    CURRENT APPLIED PHYSICS, 2013, 13 (07) : 1426 - 1432
  • [7] Origin, secret, and application of the ideal phase-change material GeSbTe
    Yamada, Noboru
    PHYSICA STATUS SOLIDI B-BASIC SOLID STATE PHYSICS, 2012, 249 (10): : 1837 - 1842
  • [8] Characterizations and thermal stability improvement of phase-change memory device containing Ce-doped GeSbTe films
    Huang, Yu-Jen
    Tsai, Min-Chuan
    Wang, Chiung-Hsin
    Hsieh, Tsung-Eong
    THIN SOLID FILMS, 2012, 520 (09) : 3692 - 3696
  • [9] Phase Change Memory: Scaling and Applications
    Jeyasingh, Rakesh
    Liang, Jiale
    Caldwell, Marissa A.
    Kuzum, Duygu
    Wong, H. -S. Philip
    2012 IEEE CUSTOM INTEGRATED CIRCUITS CONFERENCE (CICC), 2012,
  • [10] Electrical and Thermal Behavior of Tellurium poor GeSbTe compounds for Phase Change Memory
    Boniardi, Mattia
    Redaelli, Andrea
    Tortorelli, Innocenzo
    Lavizzari, Simone
    Pirovano, Agostino
    Pellizzer, Fabio
    Varesi, Enrico
    Erbetta, Davide
    Bresolin, Camillo
    Modelli, Alberto
    Bez, Roberto
    2012 4TH IEEE INTERNATIONAL MEMORY WORKSHOP (IMW), 2012,