Novel 600-V trench high-conductivity IGBT (trench HiGT) with short-circuit capability

被引:32
|
作者
Oyama, K [1 ]
Kohno, Y [1 ]
Sakano, J [1 ]
Uruno, J [1 ]
Ishizaka, K [1 ]
Kawase, D [1 ]
Mori, M [1 ]
机构
[1] Hitachi Ltd, Hitachi Res Lab, Hitachi, Ibaraki 3191292, Japan
关键词
D O I
10.1109/ISPSD.2001.934642
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper describes new 600-V trench high-conductivity IGBTs (trench HiGTs) that have lower on-state voltages of 1.42 and 1.55 V at 200 A/cm(2) and tough short-circuit capabilities of 5 and 10 mus, respectively. These HiGT have a better trade-off between turn-off losses and on-state voltages than conventional trench IGBTs, even better than planar IGBTs. They also offer a lower reverse transfer capacitances (-50%) than the planar IGBT. The input capacitance obtained were lower (-30% to -60%) than that of a conventional trench IGBT.
引用
收藏
页码:417 / 420
页数:4
相关论文
共 49 条
  • [41] Enhanced Short-circuit Capability for 1.2 kV SiC SBD-integrated Trench MOSFETs Using Cu Blocks Sintered on the Source Pad
    Yao, Kailun
    Kato, Fumiki
    Tanaka, So
    Harada, Shinsuke
    Sato, Hiroshi
    Yano, Hiroshi
    Iwamuro, Noriyuki
    2022 IEEE 34TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD), 2022, : 297 - 300
  • [42] A novel double-trench SiC SBD-embedded MOSFET with improved figure-of-merit and short-circuit ruggedness
    Hu, Ziwei
    Yao, Jiafei
    Yang, Fan
    Dai, Yuxuan
    Yang, Kemeng
    Li, Man
    Chen, Jing
    Zhang, Maolin
    Zhang, Jun
    Guo, Yufeng
    MICROELECTRONICS JOURNAL, 2025, 155
  • [43] SiC Double Trench MOSFET with Split Gate and Integrated Schottky Barrier Diode for Ultra-low Power Loss and Improved Short-Circuit Capability
    Jinping ZHANG
    Qinglin WU
    Zixun CHEN
    Hua ZOU
    Bo ZHANG
    Chinese Journal of Electronics, 2024, 33 (05) : 1127 - 1136
  • [44] SiC Double Trench MOSFET with Split Gate and Integrated Schottky Barrier Diode for Ultra-Low Power Loss and Improved Short-Circuit Capability
    Zhang, Jinping
    Wu, Qinglin
    Chen, Zixun
    Zou, Hua
    Zhang, Bo
    CHINESE JOURNAL OF ELECTRONICS, 2024, 33 (05) : 1127 - 1136
  • [45] Novel IGBT chip design concept of high turn-off current capability and high short circuit capability for 2.5kV power pack IGBT
    Yoshikawa, Koh
    Koga, Takeharu
    Fujii, Takeshi
    Katoh, Tsutomu
    Takahashi, Yoshikazu
    Seki, Yasukazu
    IEEE International Symposium on Power Semiconductor Devices and ICs (ISPSD), 1999, : 177 - 180
  • [46] Novel Integrated Double pMOS SOI-LIGBT With Low Loss and High Short-Circuit Capability
    Wei, Jie
    Lu, Jinlong
    Dai, Kaiwei
    Tan, Jialei
    Liu, Renkuan
    Zhu, Pengchen
    Li, Hui
    Zhang, Bo
    Luo, Xiaorong
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2024, 71 (11) : 7199 - 7203
  • [47] Novel double MOS-resistors SOI-LIGBT with low forward voltage and high short-circuit capability
    Yang, Kemeng
    Su, Wei
    Wei, Jie
    Wang, Junnan
    Ma, Zhen
    Li, Zhaoji
    Luo, Xiaorong
    2022 IEEE 34TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD), 2022, : 157 - 160
  • [48] Experimental Demonstration of the Double-Trench, Buried-P JTE Edge Termination with Short Edge Width and High dV/dt Capability for 1200 V-class SiC Devices
    Liu, Yong
    Feng, Hao
    Peng, Xin
    Huang, Linhua
    Sin, Johnny K. O.
    2024 36TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND IC S, ISPSD 2024, 2024, : 17 - 20
  • [49] Robust 600V GaN high electron mobility transistor technology on GaN-on-Si with 400V, 5 μs load-short-circuit withstand capability
    Nagahisa, Tetsuzo
    Ichijoh, Hisao
    Suzuki, Takamitsu
    Yudin, Alex
    Adan, Alberto O.
    Kubo, Masaru
    JAPANESE JOURNAL OF APPLIED PHYSICS, 2016, 55 (04)