In-situ x-ray photoemission spectromicroscopy of electromigration in patterned Al-Cu lines with maximum

被引：0

作者：

Solak, HH ^{[1
]}

Lorusso, GF ^{[1
]}

Singh, S ^{[1
]}

Cerrina, F ^{[1
]}

Underwood, JH ^{[1
]}

Batson, P ^{[1
]}

机构：

[1] Univ Wisconsin, Dept Elect & Comp Engn, Madison, WI 53706 USA

来源：

MATERIALS RELIABILITY IN MICROELECTRONICS VIII | 1998年 / 516卷

关键词：

D O I：

10.1557/PROC-516-39

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We report the application of a unique photoemission spectromicroscope (MAXIMUM) to the study of electromigration phenomena in Al-Cu interconnects. MAXIMUM is a scanning type photoemission microscope that uses multilayer-coated optics to focus 130 eV x-rays to a sub-0.1 mu m spot. An electron energy analyzer collects photoelectrons in a chosen spectral region of interest to form an image of the sample that is sensitive to chemical states of elements on the sample surface. Al-Cu lines were characterized by spectromicroscopy techniques before and after electromigration stressing in the UHV environment of the microscope chamber. We present spectre-micrographs showing the chemical and structural changes on AI-Cu line surfaces as a result of the electromigration process.

引用

页码：39 / 43

页数：5

共 50 条

[31] In-situ characterisation of precipitation in Al-Cu thin films
Lokker, JP
Bottger, AJ
Janssen, GCAM
Radelaar, S
POLYCRYSTALLINE METAL AND MAGNETIC THIN FILMS, 1999, 562 : 269 - 274
[32] In-situ 3D investigation by fast X-ray microtomography of the microstructural changes occurring during partial remelting of Al-Cu alloys
Suery, Michel
Salvo, Luc
Josserond, Charles
Di Michiel, Marco
SEMI- SOLID PROCESSING OF ALLOYS AND COMPOSITES, 2006, 116-117 : 231 - 234
[33] Interface reactions between LiPON and lithium studied by in-situ X-ray photoemission
Schwoebel, Andre
Hausbrand, Rene
Jaegermann, Wolfram
SOLID STATE IONICS, 2015, 273 : 51 - 54
[34] Development of an in situ temperature stage for synchrotron X-ray spectromicroscopy
Chakraborty, R.
Serdy, J.
West, B.
Stuckelberger, M.
Lai, B.
Maser, J.
Bertoni, M. I.
Culpepper, M. L.
Buonassisi, T.
REVIEW OF SCIENTIFIC INSTRUMENTS, 2015, 86 (11):
[35] Observation of electromigration in a Cu thin line by in situ coherent x-ray diffraction microscopy
Takahashi, Yukio
Nishino, Yoshinori
Furukawa, Hayato
Kubo, Hideto
Yamauchi, Kazuto
Ishikawa, Tetsuya
Matsubara, Eiichiro
JOURNAL OF APPLIED PHYSICS, 2009, 105 (12)
[36] Exposure of monomolecular lithographic patterns to ambient: An X-ray photoemission spectromicroscopy study
Chen, C. -H.
Huang, M. -L.
Wang, S. -C.
Klauser, R.
Shaporenko, A.
Zharnikov, M.
JOURNAL OF PHYSICAL CHEMISTRY B, 2006, 110 (36): : 17878 - 17883
[37] In-situ electromigration damage of Al interconnect lines and the influence of grain orientation
Buerke, A
Wendrock, H
Kötter, T
Menzel, S
Wetzig, K
von Glasow, A
MATERIALS RELIABILITY IN MICROELECTRONICS IX, 1999, 563 : 109 - 114
[38] IN-SITU SEM OBSERVATIONS OF ELECTROMIGRATION VOIDS IN AL LINES UNDER PASSIVATION
FLINN, PA
MADDEN, MC
MARIEB, TN
MRS BULLETIN, 1994, 19 (06) : 51 - 55
[39] Microstructure and mechanical property of in-situ Al-Cu/TiC composites
Zhang, EL
Zeng, SY
Yang, B
Li, QC
Ma, MZ
JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 1998, 14 (03) : 255 - 258
[40] Microstructure and Mechanical Property of in-situ Al-Cu/TiC Composites
Erlin ZHANG
Songyan ZENG
Bo YANG and Qingchun LI(School of Material Science and Engineering
JournalofMaterialsScience&Technology, 1998, (03) : 255 - 258

← 1 2 3 4 5 →