Selective induction heating of metallic microstructures for wafer-level MEMS packaging

被引：0
|
作者：
Froehlich, Alexander [1 ]
Hofmann, Christian [2 ]
Rochala, Patrick [1 ]
Kimme, Jonas [1 ]
Kroll, Martin [1 ]
Kraeusel, Verena [1 ]
机构：
[1] Tech Univ Chemnitz, Inst Machine Tools & Prod Proc, Professorship Forming & Joining, Chemnitz, Germany
[2] Fraunhofer Inst Elect Nano Syst ENAS, Technol Campus 3, Chemnitz, Germany
来源：
INTERNATIONAL JOURNAL OF APPLIED ELECTROMAGNETICS AND MECHANICS | 2020年 / 63卷
关键词：
Wafer bonding; MEMS packaging; induction heating; MULTIOBJECTIVE DESIGN;
D O I：
10.3233/JAE-209121
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Considering the demand for low temperature bonding processes in packaging of micro-electro-mechanical systems (MEMS), such as accelerometers or micro mirrors, in this paper a method for selective and energy-efficient heating of metallic intermediate bonding layers by applying high-frequency electromagnetic fields with frequencies in the range of 1.0 < f < 2.0 MHz is presented. Therefore, the induction heating process was modeled and analyzed by means of numerical simulation. Additionally, heating experiments were carried out by using IR thermography in order to verify the simulation results. The developed inductor shape allows almost homogeneous heating of all metallic layers with heating rates of more than Delta T/Delta t = 150 K/s.
引用
收藏
页码：S13 / S20
页数：8
相关论文
共 50 条
  • [1] A NOVEL METHOD FOR MEMS WAFER-LEVEL PACKAGING: SELECTIVE AND RAPID INDUCTION HEATING FOR COPPER-TIN SLID BONDING
    Hofmann, Christian
    Froehlich, Alexander
    Kimme, Jonas
    Wiemer, Maik
    Otto, Thomas
    2019 20TH INTERNATIONAL CONFERENCE ON SOLID-STATE SENSORS, ACTUATORS AND MICROSYSTEMS & EUROSENSORS XXXIII (TRANSDUCERS & EUROSENSORS XXXIII), 2019, : 277 - 280
  • [2] Challenges of Wafer-Level MEMS Packaging
    Schuler-Watkins, Sebastian
    Reichenbach, Ralf
    Hansen, Uwe
    2015 EUROPEAN MICROELECTRONICS PACKAGING CONFERENCE (EMPC), 2015,
  • [3] Wafer-level vacuum packaging for MEMS
    Gooch, R
    Schimert, T
    McCardel, W
    Ritchey, B
    Gilmour, D
    Koziarz, W
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1999, 17 (04): : 2295 - 2299
  • [4] Wafer-level packaging technology for MEMS
    Mirza, AR
    ITHERM 2000: SEVENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOL I, PROCEEDINGS, 2000, : 113 - 119
  • [5] Trends in Wafer-level Packaging of MEMS: MEMS Packaging Solutions
    Baert, K.
    De Moor, P.
    Tilmans, H.
    John, J.
    Witvrouw, A.
    Van Hoof, C.
    Beyne, E.
    Advanced Packaging, 2004, 13 (04): : 25 - 27
  • [6] Selective Induction Heating for Wafer Level Bonding and Packaging
    Chen, Mingxiang
    Liu, Wenming
    Xi, Yanyan
    Lin, Changyong
    Wong, C. P.
    Liu, Sheng
    2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4, 2009, : 1754 - +
  • [7] An innovative approach to wafer-level MEMS packaging
    Teomim, D
    Badihi, A
    Zilber, G
    SOLID STATE TECHNOLOGY, 2002, 45 (01) : 57 - +
  • [8] DRIE from MEMS to wafer-level packaging
    Lea, Leslie M.
    Short, Carolyn L.
    SOLID STATE TECHNOLOGY, 2007, 50 (12) : 58 - 60
  • [9] Ceramic via wafer-level packaging for MEMS
    Heck, John M.
    Arana, Leonel R.
    Read, Bill
    Dory, Thomas S.
    ADVANCES IN ELECTRONIC PACKAGING 2005, PTS A-C, 2005, : 1069 - 1074
  • [10] Vacuum wafer-level packaging for MEMS applications
    Caplet, S
    Sillon, N
    Delaye, MT
    Berruyer, P
    MICROMACHINING AND MICROFABRICATION PROCESS TECHNOLOGY VIII, 2003, 4979 : 271 - 278
12345