The formation mechanism of the structure and internal stresses in multilayer Co/Cu films

被引：0
|
作者：
Tochitskii, TA
Fedosyuk, VM
Kasyutich, OI
机构：
来源：
RUSSIAN JOURNAL OF ELECTROCHEMISTRY | 1996年 / 32卷 / 06期
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暂无
中图分类号：
O646 [电化学、电解、磁化学];
学科分类号：
081704 ;
摘要：
The formation of internal stresses in multilayered Co/Cu coatings is explained by periodical accumulation of maximum mismatch of cobalt and copper planes during their conjugation at the interfaces. The mechanism governing formation of the layers and their subsequent growth is analyzed.
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页码：710 / 713
页数：4
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