Design & Analysis of a Novel IGBT Package with Double-Sided Cooling

被引：0
|
作者：
Zhong, Yulin [1 ]
Meng, Jinlei [1 ]
Ning, Puqi [1 ]
Wen, Xuhui [1 ]
机构：
[1] Chinese Acad Sci, Key Lab Power Elect & Elect Drive, Beijing 100864, Peoples R China
来源：
2014 IEEE TRANSPORTATION ELECTRIFICATION CONFERENCE AND EXPO (ITEC) ASIA-PACIFIC 2014 | 2014年
关键词：
Double-Sided Cooling; IGBT Package Design; Thermal Resistance; Parasitics Extraction;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Conventional IGBT modules with bonding wires have been suffered from relatively high thermal resistance from junction to case (Rthjc) due to unavoidable single-sided cooling (SSC), and also suffered from uneven current distribution due to unsymmetrical electrical interconnection. A novel IGBT package with double-sided cooling (DSC) geometry was proposed in this paper to overcome these problems. A comprehensive comparative study between the DSC geometry and the SSC geometry has been conducted by simulations. The analytical results demonstrate that the DSC geometry is well superior to the conventional SSC geometry in both electrical and thermal behavior, which predicts a brighter future in various key applications for this emerging package.
引用
收藏
页数：6
相关论文
共 50 条
  • [1] Double-Sided Cooling Design for Novel Planar Module
    Ning, Puqi
    Liang, Zhenxian
    Wang, Fei
    2013 TWENTY-EIGHTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2013), 2013, : 616 - 621
  • [2] Development of new power mosfets package with double-sided cooling
    Ashida, Kisho
    Muto, Akira
    Shimizu, Ichio
    Kawano, Kenya
    Tanaka, Naotaka
    Yoneda, Nae
    IPACK 2007: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2007, VOL 1, 2007, : 423 - 427
  • [3] Research on heat dissipation performance of double-sided cooling IGBT module
    Huang, Zuoyi
    An, Tong
    Qin, Fei
    Gong, Yanpeng
    Dai, Yanwei
    Wang, Zhen
    2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
  • [4] Thermal and Thermomechanical Analysis of a 10 kV SiC MOSFET Package with Double-Sided Cooling
    Cairnie, Mark
    Gersh, Jacob
    DiMarino, Christina
    2021 IEEE 8TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA), 2021, : 394 - 399
  • [5] 200 kVA Compact IGBT Modules with Double-Sided Cooling for HEV and EV
    Chang, Hsueh-Rong
    Bu, Jiankang
    Hauenstein, Henning
    Wittmann, Michael
    Marcinkowski, Jack
    Pavier, Mark
    Palmer, Scott
    Tompkins, Jim
    2012 24TH INTERNATIONAL SYMPOSIUM ON POWER SEMICONDUCTOR DEVICES AND ICS (ISPSD), 2012, : 299 - 302
  • [6] Heat Dissipation Simulation of Double-sided Liquid-cooled IGBT Module Package
    Xu, Yuan
    Bao, Jie
    Ning, Renxia
    Hou, Li
    Chen, Zhenhai
    Xu, Wenyi
    Zhou, Bin
    ICEPT2019: THE 2019 20TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2019,
  • [7] Thermal Characterisation of a Copper-Clip-Bonded IGBT Module with Double-sided Cooling
    Zhu, Qingwei
    Forsyth, Andrew
    Todd, Rebecca
    Mills, Liam
    2017 23RD INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC), 2017,
  • [8] Double-sided cooling for high power IGBT modules using flip chip technology
    Gillot, C
    Schaeffer, C
    Massit, C
    Meysenc, L
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2001, 24 (04): : 698 - 704
  • [9] Double-sided cooling for high power IGBT modules using flip chip technology
    Gillot, C
    Schaeffer, C
    Ferret, R
    Massit, C
    Meysenc, L
    IAS 2000 - CONFERENCE RECORD OF THE 2000 IEEE INDUSTRY APPLICATIONS CONFERENCE, VOLS 1-5, 2000, : 3016 - 3020
  • [10] DOUBLE-SIDED COOLING TECHNOLOGY FOR EMOBILITY
    Pressel, Klaus
    Grassmann, Andreas
    Fink, Markus
    49TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE (ESSDERC 2019), 2019, : 28 - 30
12345