DOUBLE-SIDED COOLING TECHNOLOGY FOR EMOBILITY

被引：0
|
作者：
Pressel, Klaus [1 ]
Grassmann, Andreas [1 ]
Fink, Markus [1 ]
机构：
[1] Infineon Technol AG, Assembly & Packaging Dev, Regensburg, Germany
来源：
49TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE (ESSDERC 2019) | 2019年
关键词：
double-sided cooling; molded module; power device; thermo-mechanical study;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In this paper we introduce a device concept for double-sided cooling based on a molded module. This concept allows device shrinking and tackling the needed power density. Thermo-mechanical investigations together with proper processes and material choices are prerequisite to reach the needed reliability. Our used simulation model is successfully validated with experimental data and able to predict the thermo-mechanical behavior of such molded power module.
引用
收藏
页码：28 / 30
页数：3
相关论文
共 50 条
  • [1] Double-sided Nickel-Tin Transient Liquid Phase Bonding for Double-sided Cooling
    Yoon, Sang Won
    Shiozaki, Koji
    Kato, Takehiro
    2014 TWENTY-NINTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC), 2014, : 527 - +
  • [2] Double-sided cooling for high power IGBT modules using flip chip technology
    Gillot, C
    Schaeffer, C
    Massit, C
    Meysenc, L
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2001, 24 (04): : 698 - 704
  • [3] Double-sided cooling for high power IGBT modules using flip chip technology
    Gillot, C
    Schaeffer, C
    Ferret, R
    Massit, C
    Meysenc, L
    IAS 2000 - CONFERENCE RECORD OF THE 2000 IEEE INDUSTRY APPLICATIONS CONFERENCE, VOLS 1-5, 2000, : 3016 - 3020
  • [4] Investigation of Vehicle-Oriented Double-Sided Cooling Power Module With BGA Technology
    Peng, Cheng
    Zhu, Wenhui
    Ke, Pan
    Li, Ran
    Dai, Xiaoping
    Wang, Liancheng
    IEEE JOURNAL OF EMERGING AND SELECTED TOPICS IN POWER ELECTRONICS, 2022, 10 (05) : 6171 - 6179
  • [5] Double-Sided Cooling Design for Novel Planar Module
    Ning, Puqi
    Liang, Zhenxian
    Wang, Fei
    2013 TWENTY-EIGHTH ANNUAL IEEE APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION (APEC 2013), 2013, : 616 - 621
  • [6] A double-sided PDMS mold for double-sided embossing by rollers
    Hsu, Ming-Huai
    Tsai, Yao-Yang
    He, Jyun-Wei
    Yang, Sen-Yeu
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2024, 30 (01): : 47 - 54
  • [7] A double-sided PDMS mold for double-sided embossing by rollers
    Ming-Huai Hsu
    Yao-Yang Tsai
    Jyun-Wei He
    Sen-Yeu Yang
    Microsystem Technologies, 2024, 30 : 47 - 54
  • [8] A double-sided PDMS mold for double-sided embossing by rollers
    Hsu, Ming-Huai
    Tsai, Yao-Yang
    He, Jyun-Wei
    Yang, Sen-Yeu
    MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2024, 30 (01): : 47 - 54
  • [9] Design & Analysis of a Novel IGBT Package with Double-Sided Cooling
    Zhong, Yulin
    Meng, Jinlei
    Ning, Puqi
    Wen, Xuhui
    2014 IEEE TRANSPORTATION ELECTRIFICATION CONFERENCE AND EXPO (ITEC) ASIA-PACIFIC 2014, 2014,
  • [10] Development of new power mosfets package with double-sided cooling
    Ashida, Kisho
    Muto, Akira
    Shimizu, Ichio
    Kawano, Kenya
    Tanaka, Naotaka
    Yoneda, Nae
    IPACK 2007: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2007, VOL 1, 2007, : 423 - 427
12345