DOUBLE-SIDED COOLING TECHNOLOGY FOR EMOBILITY

被引：0

作者：

Pressel, Klaus ^{[1
]}

Grassmann, Andreas ^{[1
]}

Fink, Markus ^{[1
]}

机构：

[1] Infineon Technol AG, Assembly & Packaging Dev, Regensburg, Germany

来源：

49TH EUROPEAN SOLID-STATE DEVICE RESEARCH CONFERENCE (ESSDERC 2019) | 2019年

关键词：

double-sided cooling; molded module; power device; thermo-mechanical study;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this paper we introduce a device concept for double-sided cooling based on a molded module. This concept allows device shrinking and tackling the needed power density. Thermo-mechanical investigations together with proper processes and material choices are prerequisite to reach the needed reliability. Our used simulation model is successfully validated with experimental data and able to predict the thermo-mechanical behavior of such molded power module.

引用

页码：28 / 30

页数：3

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