Design & Analysis of a Novel IGBT Package with Double-Sided Cooling

被引：0

作者：

Zhong, Yulin ^{[1
]}

Meng, Jinlei ^{[1
]}

Ning, Puqi ^{[1
]}

Wen, Xuhui ^{[1
]}

机构：

[1] Chinese Acad Sci, Key Lab Power Elect & Elect Drive, Beijing 100864, Peoples R China

来源：

2014 IEEE TRANSPORTATION ELECTRIFICATION CONFERENCE AND EXPO (ITEC) ASIA-PACIFIC 2014 | 2014年

关键词：

Double-Sided Cooling; IGBT Package Design; Thermal Resistance; Parasitics Extraction;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Conventional IGBT modules with bonding wires have been suffered from relatively high thermal resistance from junction to case (Rthjc) due to unavoidable single-sided cooling (SSC), and also suffered from uneven current distribution due to unsymmetrical electrical interconnection. A novel IGBT package with double-sided cooling (DSC) geometry was proposed in this paper to overcome these problems. A comprehensive comparative study between the DSC geometry and the SSC geometry has been conducted by simulations. The analytical results demonstrate that the DSC geometry is well superior to the conventional SSC geometry in both electrical and thermal behavior, which predicts a brighter future in various key applications for this emerging package.

引用

页数：6

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