共 50 条
- [34] Electronics packaging Yosetsu Gakkai Shi/Journal of the Japan Welding Society, 2010, 79 (05): : 110 - 111
- [36] Thermal modeling of diamond-based power electronics packaging FIFTEENTH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, 1999, : 98 - 104
- [37] Development of TSV-based Inductors in Power Electronics Packaging 2015 16TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, 2015,
- [38] Impact of Heat Dissipation Profiles on Power Electronics Packaging Design 2018 IEEE TRANSPORTATION AND ELECTRIFICATION CONFERENCE AND EXPO (ITEC), 2018, : 482 - 487
- [39] Power Electronics Packaging for In-Road Wireless Charging Installations 2021 IEEE PELS WORKSHOP ON EMERGING TECHNOLOGIES: WIRELESS POWER TRANSFER (WOW 2021), 2021,