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- [2] Overview of the DoD needs for power electronics and power electronics packaging Adv Microelectron, 1 (17-19):
- [4] AN OPTIMIZED POWER ELECTRONICS PACKAGING CONCEPT PROCEEDINGS OF THE TECHNICAL CONFERENCE : NINTH ANNUAL INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE, VOLS 1 AND 2, 1989, : 686 - 696
- [5] Securing the reliability of power electronics packaging ETG-Fachberichte (Energietechnische Gesellschaft im VDE), 2000, (81): : 125 - 133
- [6] Al/SiC for power electronics packaging 3RD INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS - PROCESSES, PROPERTIES, AND INTERFACES - PROCEEDINGS, 1997, : 162 - 165
- [7] Packaging and Integration and the Future of Power Electronics IEEE POWER ELECTRONICS MAGAZINE, 2020, 7 (03): : 86 - 90
- [8] A framework for developing power electronics packaging APEC '98 - THIRTEENTH ANNUAL APPLIED POWER ELECTRONICS CONFERENCE AND EXPOSITION, VOLS 1 AND 2, 1998, : 9 - 15
- [9] SiC power electronics packaging prognostics 2008 IEEE AEROSPACE CONFERENCE, VOLS 1-9, 2008, : 3639 - +
- [10] MODELLING RELIABILITY OF POWER ELECTRONICS PACKAGING IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 2, 2010, : 215 - 220