Overview of the DoD needs for power electronics and power electronics packaging

被引:0
|
作者
Electronics Manufacturing, Productivity Facility, Indiannapolis, United States [1 ]
机构
来源
Adv Microelectron | / 1卷 / 17-19期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [1] Power electronics packaging
    Suganuma, Katsuaki
    Song, Jenn-Ming
    Lai, Yi-Shao
    MICROELECTRONICS RELIABILITY, 2015, 55 (12) : 2523 - 2523
  • [2] An overview to integrated power module design for high power electronics packaging
    Lostetter, AB
    Barlow, F
    Elshabini, A
    MICROELECTRONICS RELIABILITY, 2000, 40 (03) : 365 - 379
  • [3] Overview to integrated power module design for high power electronics packaging
    Lostetter, A.B.
    Barlow, F.
    Elshabini, A.
    2000, Elsevier Science Ltd, Exeter, United Kingdom (40)
  • [5] Overview of SiC power electronics
    Chelnokov, VE
    Syrkin, AL
    Dmitriev, VA
    DIAMOND AND RELATED MATERIALS, 1997, 6 (10) : 1480 - 1484
  • [6] Trends of the Power Electronics Devices and the Electronics Packaging; Technologies for Automotive Electronics Products
    Kamiya A.
    Journal of Japan Institute of Electronics Packaging, 2021, 24 (03)
  • [7] SIC POWER DEVICES IN POWER ELECTRONICS: AN OVERVIEW
    Alves, Luciano F. S.
    Gomes, Ruan C. M.
    Lefranc, Pierre
    Pegado, Raoni de A.
    Jeannin, Pierre-Olivier
    Luciano, B. A.
    Rocha, Filipe V.
    2017 XIV BRAZILIAN POWER ELECTRONICS CONFERENCE (COBEP), 2017,
  • [8] AN OPTIMIZED POWER ELECTRONICS PACKAGING CONCEPT
    SHARMA, R
    ESTES, E
    PROCEEDINGS OF THE TECHNICAL CONFERENCE : NINTH ANNUAL INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE, VOLS 1 AND 2, 1989, : 686 - 696
  • [9] Securing the reliability of power electronics packaging
    Lefranc, G.
    Licht, T.
    Mitic, G.
    Wolfgang, E.
    ETG-Fachberichte (Energietechnische Gesellschaft im VDE), 2000, (81): : 125 - 133
  • [10] An approach to deal with packaging in power electronics
    Popovic, J
    Ferreira, JA
    IEEE TRANSACTIONS ON POWER ELECTRONICS, 2005, 20 (03) : 550 - 557