Enhanced pluggable out-of-plane coupling components for Printed Circuit Board-level optical interconnections

被引:5
|
作者
Van Erps, J. [1 ]
Heyvaert, S. [1 ]
Debaes, C. [1 ]
Van Giel, B. [1 ]
Hendrickx, N. [2 ]
Van Daele, P. [2 ]
Thienpont, H. [1 ]
机构
[1] Vrije Univ Brussel, Dept Appl Phys & Photon FirW TONA, B-1050 Brussels, Belgium
[2] Univ Ghent, Dept Informat Technol INTEC TFCG, B-9052 Ghent, Belgium
来源
MICRO-OPTICS 2008 | 2008年 / 6992卷
关键词
coupling components; Deep Proton Writing (DPW); micro-mirror; non-sequential ray tracing; optical simulations; polymer waveguides; rapid prototyping;
D O I
10.1117/12.779265
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
We present an enhanced out-of-plane coupling component for Printed Circuit Board-level optical interconnections. Rather than using a standard 45 degrees micro-mirror to turn the light path over 90 degrees, We introduce a curvature in the mirror profile and incorporate an extra cylindrical micro-lens for beam collimation. Both modifications enable an increase in coupling efficiency and are extensively investigated using non-sequential ray tracing simulations in combination with Matlab optimization algorithms. The resulting design is fabricated using Deep Proton Writing and experimental characterization of the geometrical properties and measured coupling efficiencies are presented.
引用
收藏
页数:11
相关论文
共 50 条
  • [31] Optical interconnection technology on the printed circuit board level: Fundamentals - Technology - Design
    Griese, Elmar
    PROCEEDINGS OF THE 2005 INTERNATIONAL STUDENTS AND YOUNG SCIENTISTS WORKSHOP PHOTONICS AND MICROSYSTEMS, 2005, : 39 - 43
  • [32] Enhanced convection from horizontal printed-circuit board with lifted electronic components
    H. J. Kang
    C. W. Leung
    Heat and Mass Transfer, 1998, 33 : 265 - 272
  • [33] Enhanced convection from horizontal printed-circuit board with lifted electronic components
    Kang, HJ
    Leung, CW
    HEAT AND MASS TRANSFER, 1998, 33 (04) : 265 - 272
  • [34] Enhanced convection from horizontal printed-circuit board with lifted electronic components
    Hong Kong Polytechnic Univ, Kowloon, Hong Kong
    Heat Mass Transfer, 4 (265-272):
  • [35] Single Mode Polymer Optical Waveguides and Out-of-plane Coupling Structure on a Glass Substrate
    Boucaud, J. M.
    Hivin, Q.
    Durand, C.
    Gianesello, F.
    Bucci, D.
    Robillard, J. F.
    Vaurette, F.
    Broquin, J. E.
    Dubois, E.
    2018 7TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2018,
  • [36] Diffractive Grating Based Out-of-Plane Coupling between Silicon Nanowire and Optical Fiber
    Li, Z. -Y
    Zhu, Y.
    Zhou, L.
    Li, Y. -T.
    Han, W. -H.
    Fan, Z. -C.
    Yu, Y. -D.
    Yu, J. -Z.
    2009 LASERS & ELECTRO-OPTICS & THE PACIFIC RIM CONFERENCE ON LASERS AND ELECTRO-OPTICS, VOLS 1 AND 2, 2009, : 1276 - +
  • [37] High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies
    E.H. Wong
    S.K.W. Seah
    C.S. Selvanayagam
    R. Rajoo
    W.D. van Driel
    J.F.J.M. Caers
    X.J. Zhao
    N. Owens
    M. Leoni
    L.C. Tan
    Y.-S. Lai
    C.-L. Yeh
    Journal of Electronic Materials, 2009, 38 : 884 - 895
  • [38] ENHANCED PRINTED CIRCUIT BOARD DESIGN-SOLDER MASK WIRING PLANE RELATIONSHIP.
    De Marco, J.L.
    Healey, H.J.
    Houser, D.E.
    Jaw, C.S.
    Kopl, T.J.
    Lubert, K.J.
    Senger, R.C.
    Thompson, W.U.
    IBM technical disclosure bulletin, 1984, 27 (4 B): : 2609 - 2610
  • [39] High-Speed Cyclic Bend Tests and Board-Level Drop Tests for Evaluating the Robustness of Solder Joints in Printed Circuit Board Assemblies
    Wong, E. H.
    Seah, S. K. W.
    Selvanayagam, C. S.
    Rajoo, R.
    van Driel, W. D.
    Caers, J. F. J. M.
    Zhao, X. J.
    Owens, N.
    Leoni, M.
    Tan, L. C.
    Lai, Y. -S.
    Yeh, C. -L.
    JOURNAL OF ELECTRONIC MATERIALS, 2009, 38 (06) : 884 - 895
  • [40] Optical interconnection technology on the printed circuit board level: technology-design-application
    Griese, E
    2002 IEEE/LEOS ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS 1 AND 2, 2002, : 123 - 124