共 50 条
- [21] Laser ablated coupling structures for stacked optical interconnections on printed circuit boards MICRO-OPTICS, VCSELS, AND PHOTONIC INTERCONNECTS II: FABRICATION, PACKAGING, AND INTEGRATION, 2006, 6185
- [23] Board-Level Power Integrity Analysis for Complex High-Speed Printed Circuit Boards 2022 IEEE 26TH WORKSHOP ON SIGNAL AND POWER INTEGRITY (SPI), 2022,
- [26] Out-Of-Plane Coupling Using Thin Glass Based Arrayed Waveguide Components PHOTONICS PACKAGING, INTEGRATION, AND INTERCONNECTS IX, 2009, 7221
- [27] Prototyping micro-optical components with integrated out-of-plane coupling structures using Deep Lithography with Protons MICRO-OPTICS, VCSELS, AND PHOTONIC INTERCONNECTS II: FABRICATION, PACKAGING, AND INTEGRATION, 2006, 6185
- [28] The optoelectronic interface issue in optical interconnects at printed circuit board level GLASS SCIENCE AND TECHNOLOGY, 2005, 78 : 11 - 18
- [29] Coupling of vias in electronic packaging and printed circuit board structures with finite ground plane IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2003, 26 (04): : 375 - 384