A practical sputter equipment simulation system for aluminum including surface diffusion model

被引:0
|
作者
Yamada, H [1 ]
Ohta, T [1 ]
Kaneko, H [1 ]
Yamada, Y [1 ]
机构
[1] NEC CORP LTD,ULSI DEVICE DEV LABS,SAGAMIHARA,KANAGAWA 229,JAPAN
关键词
D O I
10.1109/SISPAD.1996.865280
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
引用
收藏
页码:77 / 78
页数:2
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