A practical sputter equipment simulation system for aluminum including surface diffusion model

被引：0
|
作者：
Yamada, H [1 ]
Ohta, T [1 ]
Kaneko, H [1 ]
Yamada, Y [1 ]
机构：
[1] NEC CORP LTD,ULSI DEVICE DEV LABS,SAGAMIHARA,KANAGAWA 229,JAPAN
来源：
SISPAD '96 - 1996 INTERNATIONAL CONFERENCE ON SIMULATION OF SEMICONDUCTOR PROCESSES AND DEVICES | 1996年
关键词：
D O I：
10.1109/SISPAD.1996.865280
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：77 / 78
页数：2
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