Inductance measurement of lead-frame packages

In the inductance measurement of lead-frame packages, according to EIA/JEP123 Guideline, when the direct connection from the die-attach pad to the ground cannot be provided, remote half of the leads are connected to the ground to provide low inductance current return path. In this paper, it is demonstrated through numerical simulations that this measurement setup can introduce considerable amount of error especially for the mutual inductance measurement. A new method is proposed to increase the accuracy of the measurement, and the effectiveness of the method is demonstrated by numerical simulation with FastHenry.