Inductance measurement of lead-frame packages

被引：0
|
作者：
Shi, WM [1 ]
Fang, JY [1 ]
Yin, M [1 ]
机构：
[1] SUNY Binghamton, Dept Elect Engn, Binghamton, NY 13902 USA
来源：
ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING | 1998年
关键词：
D O I：
10.1109/EPEP.1998.733748
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
In the inductance measurement of lead-frame packages, according to EIA/JEP123 Guideline, when the direct connection from the die-attach pad to the ground cannot be provided, remote half of the leads are connected to the ground to provide low inductance current return path. In this paper, it is demonstrated through numerical simulations that this measurement setup can introduce considerable amount of error especially for the mutual inductance measurement. A new method is proposed to increase the accuracy of the measurement, and the effectiveness of the method is demonstrated by numerical simulation with FastHenry.
引用
收藏
页码：50 / 53
页数：4
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