Packaging and interconnect for RF and microwave

被引：0
|
作者：
Collander, P [1 ]
机构：
[1] Nokia Networks, FIN-00045 Espoo, Finland
来源：
INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS | 2002年 / 32卷 / 04期
关键词：
packaging; interconnect; single chip package; multichip modules; radio frequency; telecommunication;
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
The paper will review different packaging and interconnect issues in the telecom market where RF properties dominate. A short review of single chip packages for different frequency ranges will be followed by a deeper view into multichip modules of different constructions. Last the growing importance of passives and the opportunities to integrate them will be discussed. The view is from a system house that needs to source or subcontract all components and most assemblies.
引用
收藏
页码：269 / 271
页数：3
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