Packaging and interconnect for RF and microwave

被引：0

作者：

Collander, P ^{[1
]}

机构：

[1] Nokia Networks, FIN-00045 Espoo, Finland

来源：

INFORMACIJE MIDEM-JOURNAL OF MICROELECTRONICS ELECTRONIC COMPONENTS AND MATERIALS | 2002年 / 32卷 / 04期

关键词：

packaging; interconnect; single chip package; multichip modules; radio frequency; telecommunication;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The paper will review different packaging and interconnect issues in the telecom market where RF properties dominate. A short review of single chip packages for different frequency ranges will be followed by a deeper view into multichip modules of different constructions. Last the growing importance of passives and the opportunities to integrate them will be discussed. The view is from a system house that needs to source or subcontract all components and most assemblies.

引用

页码：269 / 271

页数：3

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