High Aspect Ratio Silicon Tip Cathodes for Application in Field Emission Electron Sources

被引:0
|
作者
Langer, Christoph [1 ]
Lawrowski, Robert [1 ]
Prommesberger, Christian [1 ]
Dams, Florian [1 ]
Serbun, Pavel [2 ]
Bachmann, Michael [3 ]
Mueller, Guenter [2 ]
Schreiner, Rupert [1 ]
机构
[1] OTH Regensburg, Fac Microsyst Technol, Regensburg, Germany
[2] Univ Wuppertal, FB Phys Dept C, Wuppertal, Germany
[3] KETEK, Munich, Germany
关键词
field emission; field emitter array; silicon tip;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Precisely aligned arrays of sharp tip structures on top of elongated pillars were realized by using an improved fabrication process including an additional inductively-coupledplasma reactive-ion etching step. Arrays of n-type and p-type silicon with 271 tips have been fabricated and investigated. Those structures have a total height of 5 6 tim and apex radii less than 20 nm. Integral field emission measurements of the arrays yielded low onset-fields in the range of 8-12 V/mu m and field enhancement factors between 300 and 700. The I-E curves of n-type structures showed the usual Fowler-Nordheim behaviour, whereas p-type structures revealed a significant saturation region due to the limited number of electrons in the conduction band and a further carrier depletion effect caused by the pillar. The maximum integral current in the saturation region was 150 nA at fields above 30 V/mu m. An excellent stability of the emission current of less than +/- 2 % fluctuation was observed in the saturation region. For n-type Si a maximum integral current of 10 mu A at 24 V/mu m and an average current stability with a fluctuation of +/- 50 % were measured.
引用
收藏
页数:2
相关论文
共 50 条
  • [41] HIGH ASPECT RATIO DEEP SILICON ETCHING
    Owen, K. J.
    VanDerElzen, B.
    Peterson, R. L.
    Najafi, K.
    2012 IEEE 25TH INTERNATIONAL CONFERENCE ON MICRO ELECTRO MECHANICAL SYSTEMS (MEMS), 2012,
  • [42] Etching high aspect ratio silicon trenches
    Panda, S
    Ranade, R
    Mathad, GS
    PLASMA PROCESSING XIV, 2002, 2002 (17): : 210 - 217
  • [43] High aspect ratio silicon etch: A review
    Wu, Banqiu
    Kumar, Ajay
    Pamarthy, Sharma
    JOURNAL OF APPLIED PHYSICS, 2010, 108 (05)
  • [44] ELECTRON OPTICS OF A FIELD-EMISSION TIP
    NOMURA, S
    KOMODA, T
    SAKITANI, Y
    JOURNAL OF ELECTRON MICROSCOPY, 1972, 21 (03): : 204 - 204
  • [45] Field emission from carbon nanotubes and its application to electron sources
    Saito, Y
    Uemura, S
    CARBON, 2000, 38 (02) : 169 - 182
  • [46] Field emission from carbon nanotubes and its application to electron sources
    Saito, Y
    Uemura, S
    ELECTRONIC PROPERTIES OF NOVEL MATERIALS - SCIENCE AND TECHNOLOGY OF MOLECULAR NANOSTRUCTURES, 1999, 486 : 439 - 443
  • [47] Secondary electron emission yield from high aspect ratio carbon velvet surfaces
    Jin, Chenggang
    Ottaviano, Angelica
    Raitses, Yevgeny
    JOURNAL OF APPLIED PHYSICS, 2017, 122 (17)
  • [48] SILICON COLD CATHODES AS POSSIBLE SOURCES IN ELECTRON LITHOGRAPHY SYSTEMS
    VANGORKOM, GGP
    HOEBERECHTS, AME
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1987, 5 (04): : 1544 - 1548
  • [49] Effect of the glassy carbon structure on the aspect ratio of micropoints of matrix field-emission cathodes prepared by thermochemical etching
    Pleshkova, L. S.
    Shesterkin, V. I.
    TECHNICAL PHYSICS, 2016, 61 (11) : 1747 - 1750
  • [50] Effect of the glassy carbon structure on the aspect ratio of micropoints of matrix field-emission cathodes prepared by thermochemical etching
    L. S. Pleshkova
    V. I. Shesterkin
    Technical Physics, 2016, 61 : 1747 - 1750