Plasma charging induced gate oxide damage during metal etching and ashing

被引:0
|
作者
Lin, HC [1 ]
Perng, CH [1 ]
Chien, CH [1 ]
Chiou, SG [1 ]
Chang, TF [1 ]
Huang, TY [1 ]
Chang, CY [1 ]
机构
[1] NATL NANO DEVICE LAB,HSINCHU,TAIWAN
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暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
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页码:113 / 116
页数:4
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