Broadband On-Chip Transmission Line Characterization Used in High-Speed and High-Frequency Communications

被引:0
|
作者
Huang, Chien-Chang [1 ]
Fu, Wen-Tsao [1 ]
Cheng, Kuan-Chien [1 ]
机构
[1] Yuan Ze Univ, Dept Elect Engn, Taoyuan, Taiwan
关键词
CMOS; GaAs; GIPD; on-wafer calibration; reference impedance; transmission line; CHARACTERISTIC-IMPEDANCE; SERIES-RESISTOR;
D O I
10.1109/RFIT52905.2021.9565308
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
This paper presents the broadband characterization of on-chip transmission lines (TLs) in coplanar waveguide (CPW) for various semiconductor technologies, based on the calibration comparison technique. The commercial impedance standard substrate (ISS) is used as the first-tier calibration to the probe tips by using line-reflect-reflect-match (LRRM), then the second-tier multiline thru-reflect-line (TRL) calibration is performed to extract the TL propagation constant and characteristic impedance, provided the probe pad satisfies the shunt/series circuit model. The GaAs, glass integrated passive device (GIPD) and CMOS technologies in CPW are demonstrated for TL characterization from 2 GHz to 110 GHz, with verifications of another measurement method using a series resistor.
引用
收藏
页数:2
相关论文
共 50 条
  • [21] HIGH-SPEED BROADBAND COMMUNICATIONS VIA SATELLITE.
    Nakashima, Hiroshi
    Yoshikawa, Tatsuo
    Satoh, Kohei
    Reports of the Electrical Communication Laboratory, 1985, 33 (04): : 623 - 630
  • [22] HIGH-SPEED BROADBAND COMMUNICATIONS VIA SATELLITE.
    Nakashima, Hiroshi
    Watanabe, Yoshio
    Yoshikawa, Tatsuo
    Sato, Kohei
    Denki Tsushin Kenkyusho Kenkyu Jitsuyoka Hokoku, 1984, 33 (11): : 2705 - 2716
  • [23] HIGH-SPEED MILLING WITH HIGH-FREQUENCY MOTOR SPINDLES
    WALDVOGEL, UG
    SCHMUTZ, RH
    F&M-FEINWERKTECHNIK & MESSTECHNIK, 1985, 93 (06): : S37 - S38
  • [24] HIGH-SPEED HIGH-FREQUENCY PROCESS FOR BUTT WELDING
    不详
    MACHINERY AND PRODUCTION ENGINEERING, 1971, 118 (3056): : 872 - &
  • [25] HIGH-FREQUENCY POLYPHASE TRANSMISSION LINE
    TAI, CT
    PROCEEDINGS OF THE INSTITUTE OF RADIO ENGINEERS, 1948, 36 (11): : 1370 - 1375
  • [26] A high-speed and lightweight on-chip crossbar switch scheduler for on-chip interconnection networks
    Lee, KM
    Lee, SJ
    Yoo, HJ
    ESSCIRC 2003: PROCEEDINGS OF THE 29TH EUROPEAN SOLID-STATE CIRCUITS CONFERENCE, 2003, : 453 - 456
  • [27] Alternative to mechanical high-speed and high-frequency spindles
    EPE (European Production Engineering), 1994, (3-4):
  • [28] High-frequency transmission line transitions
    Hall, LT
    Hansen, HJ
    Abbott, D
    Smart Structures, Devices, and Systems II, Pt 1 and 2, 2005, 5649 : 171 - 179
  • [29] High-speed circuits employing on-chip magnetic components
    Black, WC
    Fayfield, RT
    1999 SOUTHWEST SYMPOSIUM ON MIXED-SIGNAL DESIGN, SSMSD 99, 1999, : 156 - 161
  • [30] A unified RLC model for high-speed on-chip interconnects
    Sim, SP
    Krishnan, S
    Petranovic, DM
    Arora, ND
    Lee, KR
    Yang, CY
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2003, 50 (06) : 1501 - 1510