Time-resolved measurement of charging on hole bottoms of SiO2 wafer exposed to plasma etching in a pulsed two-frequency capacitively coupled plasma

被引:9
|
作者
Ohmori, T
Goto, TK
Kitajima, T
Makabe, T
机构
[1] Keio Univ, Dept Elect & Elect Engn, Kohoku Ku, Yokohama, Kanagawa 2238522, Japan
[2] Natl Def Acad, Dept Elect Engn, Yokosuka, Kanagawa 2398686, Japan
关键词
pulsed; 2f-CCP; charging free process; charging in dielectric etching; emission CT; negative charge injection;
D O I
10.1143/JJAP.44.L1105
中图分类号
O59 [应用物理学];
学科分类号
摘要
We experimentally demonstrate a time chart of the shading either of electrons or positive ions on a topologically patterned wafer exposed to plasma etching by synchronized measurements of bottom-charging potential in a SiO, hole, current components incident on the wafer, and optical emission CT in the interface in a pulsed two frequency capacitively coupled plasma. The present paper gives a history of charging affected dynamically by an instantaneous electrical response on the bottom.
引用
收藏
页码:L1105 / L1108
页数:4
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