Spatial characterization of doped SiC wafers

被引:1
|
作者
Burton, JC [1 ]
Sun, L [1 ]
Pophristic, M [1 ]
Li, J [1 ]
Long, FH [1 ]
Feng, ZC [1 ]
Ferguson, I [1 ]
机构
[1] Rutgers State Univ, Dept Chem, Piscataway, NJ 08854 USA
关键词
D O I
10.1557/PROC-512-297
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Raman spectroscopy has been used to investigate wafers of both 4H-SiC and 6H-SiC. The wafers studied were semi-insulating and n-type (nitrogen) doped with concentrations between 2.1 x 10(18) cm(-3) and 1.2 x 10(19) cm(-3). Significant coupling of the Al longitudinal optical (LO) phonon to the plasmon mode was observed. The position of this peak shows a direct correlation with the carrier concentration. Examination of the Raman spectra from different positions on the wafer yielded a rudimentary spatial map of the carrier concentration. This data is compared with a resistivity map of the wafer. These results suggest that Raman spectroscopy of the LO phonon-plasmon mode can be used as a noninvasive, in situ diagnostic for SiC wafer production and substrate evaluation.
引用
收藏
页码:297 / 301
页数:5
相关论文
共 50 条
  • [21] Characterization of nonuniformity of 6H-SiC wafers by photoluminescence mapping at room temperature
    Tajima, M
    Nakane, T
    Nakata, T
    Watanabe, M
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1999, 38 (4B): : L414 - L416
  • [22] Defect characterization of 4H-SiC wafers for power electronic device applications
    Ferrero, S
    Porro, S
    Giorgis, F
    Pirri, CF
    Mandracci, P
    Ricciardi, C
    Scaltrito, L
    Sgorlon, C
    Richieri, G
    Merlin, L
    JOURNAL OF PHYSICS-CONDENSED MATTER, 2002, 14 (48) : 13397 - 13402
  • [23] Systematic Characterization of Plasma-Etched Trenches on 4H-SiC Wafers
    Pirnaci, Massimo D.
    Spitaleri, Luca
    Tenaglia, Dario
    Perricelli, Francesco
    Fragala, Maria Elena
    Bongiorno, Corrado
    Gulino, Antonino
    ACS OMEGA, 2021, 6 (31): : 20667 - 20675
  • [24] Raman imaging analysis of SiC wafers
    Mermoux, M
    Crisci, A
    Baillet, F
    SILICON CARBIDE AND RELATED MATERIALS - 2002, 2002, 433-4 : 353 - 356
  • [25] High-quality SiC wafers
    Geiger, G
    AMERICAN CERAMIC SOCIETY BULLETIN, 2004, 83 (11): : 4 - 4
  • [26] A Review on the CMP of SiC and Sapphire Wafers
    Wang, Yongguang
    Zhang, L. C.
    ADVANCES IN ABRASIVE TECHNOLOGY XIII, 2010, 126-128 : 429 - 434
  • [27] Epitaxial Graphene Growth on SiC Wafers
    Gaskill, D. K.
    Jernigan, G. G.
    Campbell, P. M.
    Tedesco, J. L.
    Culbertson, J. C.
    VanMill, B. L.
    Myers-Ward, R. L.
    Eddy, C. R., Jr.
    Moon, J.
    Curtis, D.
    Hu, M.
    Wong, D.
    McGuire, C.
    Robinson, J. A.
    Fanton, M. A.
    Stitt, J. P.
    Stitt, T.
    Snyder, D.
    Wang, X.
    Frantz, E.
    GRAPHENE AND EMERGING MATERIALS FOR POST-CMOS APPLICATIONS, 2009, 19 (05): : 117 - +
  • [28] The effect of thermal gradients on SiC wafers
    Hallin, C
    Joelsson, T
    Janzén, E
    SILICON CARBIDE AND RELATED MATERIALS - 2002, 2002, 433-4 : 193 - 196
  • [29] Characterization and photoluminescence of Co-doped SiC films
    Sun, Xianke
    Jin, Xin
    Wang, Shiqi
    Liu, Huarui
    Sun, Peng
    An, Yukai
    Guo, Ruisong
    Liu, Jiwen
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 2013, 31 (06):
  • [30] Characterization of heavily doped SOI wafers under pseudo-MOSFET configuration
    Liu, F. Y.
    Diab, A.
    Ionica, I.
    Akarvardar, K.
    Hobbs, C.
    Ouisse, T.
    Mescot, X.
    Cristoloveanu, S.
    SOLID-STATE ELECTRONICS, 2013, 90 : 65 - 72