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- [41] Development of K-band front-end devices for broadband wireless communication systems using millimeter-wave flip-chip IC technology IEICE Trans Electron, 6 (827-833):
- [42] Development of K-Band front-end devices for broadband wireless communication systems using millimeter-wave flip-chip IC technology IEICE TRANSACTIONS ON ELECTRONICS, 1998, E81C (06): : 827 - 833
- [44] Development of chip shrink technology for lateral-type GaN based HFETs using SiO2/polyimide dual IMD layers Electronic Materials Letters, 2015, 11 : 213 - 216
- [48] Sequential development of several RT-qPCR tests using LNA nucleotides and dual probe technology to differentiate SARS-CoV-2 from influenza A and B MICROBIAL BIOTECHNOLOGY, 2022, 15 (07): : 1995 - 2021
- [50] Development of the base technology for surface multichipping modules on the multilayer polyimide boards having the increased mounting density of the add-on components and using modification 2 chip ic in order to organize production of the microelectronic hubrid functional assemblies 2ND INTERNATIONAL CONFERENCE ON SATELLITE COMMUNICATIONS - PROCEEDINGS OF ICSC '96, VOLS 1-4, 1996, : E145 - E147