Development of a QAC with dual sensitivities using a bipolar full-custom IC technology

被引:5
|
作者
Inaba, S
Takamatsu, K
Ikeda, H
Tanaka, M
Tsuru, T
Sato, K
Inaba, M
Sugonyaev, VP
机构
[1] KEK, Inst Particle & Nucl Studies, High Energy Accelerator Res Org, Tsukuba, Ibaraki 3050801, Japan
[2] Miyazaki Univ, Fac Engn, Miyazaki 8892192, Japan
[3] Protvino High Energy Phys Inst, Protvino 142284, Russia
关键词
D O I
10.1016/S0168-9002(00)00541-6
中图分类号
TH7 [仪器、仪表];
学科分类号
0804 ; 080401 ; 081102 ;
摘要
A charge-to-amplitude converter (QAC) has been developed using the technology of a bipolar full-custom integrated circuit (TC). The newly developed QAC has two channels with different sensitivities: a high-sensitivity QAC channel and a wide dynamic range QAC channel. The sensitivities of both QAC channels are different by a factor of four. The input current signal is converted into a voltage amplitude within the gate signal width. The output voltages of the QAC are directly proportional to the input current signal. The QAC employs a current splitter at the input stage to meet a requirement for a wide dynamic-range conversion scheme. Both QAC channels with different sensitivities have achieved a non-linearity of 0.1% (10-bit-equivalent). The equivalent dynamic range can be realized to be 13 bits. (C) 2000 Elsevier Science B.V. All rights reserved.
引用
收藏
页码:683 / 697
页数:15
相关论文
共 50 条
  • [31] STUDIES IN LSI TECHNOLOGY ECONOMICS .2. A COMPARISON OF PRODUCT COSTS USING MSI, GATE ARRAYS, STANDARD CELLS, AND FULL CUSTOM-VLSI
    FEY, CF
    PARASKEVOPOULOS, DE
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1986, 21 (02) : 297 - 303
  • [32] Experience using pipeline embolization device with Shield Technology in a patient lacking a full postoperative dual antiplatelet therapy regimen
    Orlov, Kirill
    Kislitsin, Dmitry
    Strelnikov, Nikolay
    Berestov, Vadim
    Gorbatykh, Anton
    Shayakhmetov, Timur
    Seleznev, Pavel
    Tasenko, Anton
    INTERVENTIONAL NEURORADIOLOGY, 2018, 24 (03) : 270 - 273
  • [33] WIDE-BAND MONOLITHIC AGC AMPLIFIER FOR 400 MBIT/S OPTICAL REPEATERS USING AN ADVANCED SI-BIPOLAR IC TECHNOLOGY, SICOS
    KINOSHITA, T
    YAMASHITA, K
    MAEDA, M
    NAKAMURA, T
    ELECTRONICS LETTERS, 1986, 22 (04) : 188 - 189
  • [34] Dual-band/tri-mode receiver IC for N- and W-CDMA systems using 6"-PHEMT technology
    McNamara, B
    Zhang, S
    Murphy, M
    Banzer, HM
    Kapusta, H
    Rohrer, E
    Grave, T
    Verweyen, L
    2001 IEEE RADIO FREQUENCY INTEGRATED CIRCUITS (RFIC) SYMPOSIUM, DIGEST OF PAPERS, 2001, : 13 - 16
  • [35] A DUAL 4-BIT 2-GS S FULL NYQUIST ANALOG-TO-DIGITAL CONVERTER USING A 70-PS SILICON BIPOLAR TECHNOLOGY WITH BOROSENIC POLY PROCESS AND COUPLING-BASE IMPLANT
    GARUTS, VE
    YU, YCS
    TRAA, EO
    YAMAGUCHI, T
    IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1989, 24 (02) : 216 - 222
  • [36] Using Charge Self-compensation Domino Full-adder with Multiple Supply and Dual Threshold Voltage in 45nm Technology
    Wang, Jinhui
    Wu, Wuchen
    Hou, Ligang
    Geng, Shuqin
    Zhang, Wang
    Peng, Xiaohong
    Gong, Na
    ULIS 2009: 10TH INTERNATIONAL CONFERENCE ON ULTIMATE INTEGRATION OF SILICON, 2009, : 225 - +
  • [37] Development of a full-length cDNA-derived enterovirus A71 vaccine candidate using reverse genetics technology
    Yang, Ya-Ting
    Chow, Yen-Hung
    Hsiao, Kuang-Nan
    Hu, Kai-Chieh
    Chiang, Jen-Ron
    Wu, Suh-Chin
    Chong, Pele
    Liu, Chia-Chyi
    ANTIVIRAL RESEARCH, 2016, 132 : 225 - 232
  • [38] Development of dual phase and multiphase high strength steels by using a new cooling technology: The Howaq-twice process
    Elgoyhen, C
    De Paepe, A
    Laquerbe, L
    Lhoist, V
    Harlet, P
    STEEL RESEARCH INTERNATIONAL, 2005, 76 (07) : 532 - 538
  • [39] Development of fixed-dose combination with dual-release properties using double-melt extrusion technology
    Seo, Hee-Kyung
    Park, Chulhun
    Oh, Hye-Sung
    Park, Il-Ho
    Kang, Chin-Yang
    Lee, Beom-Jin
    Pena, Ike de la
    Weon, Kwon-Yeon
    Park, Jun-Bom
    JOURNAL OF DRUG DELIVERY SCIENCE AND TECHNOLOGY, 2023, 87
  • [40] Development of Novel Intermetallic Joints using Thin Film Indium Based Solder by Low Temperature Bonding Technology for 3D IC Stacking
    Choi, Won Kyoung
    Premachandran, C. S.
    Chiew, Ong Siong
    Ling, Xie
    Ebin, Liao
    Khairyanto, Ahmad
    Ratmin, Bin
    Chen, Kelvin
    Sheng, Wei
    Thaw, Phyo Phyo
    Lau, John H.
    2009 IEEE 59TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, VOLS 1-4, 2009, : 333 - 338