Reactive Ion Etching Parameter Effect on Aluminum Bond Pad Surface Morphology

被引：0

作者：

Palianysamy, Moganraj ^{[1
]}

Sauli, Zaliman ^{[1
]}

Hashim, Uda ^{[2
]}

Retnasamy, Vithyacharan ^{[1
]}

Taniselass, Steven ^{[1
]}

Ayub, Ramzan Mat ^{[2
]}

机构：

[1] Univ Malaysia Perlis, Sch Microelect Engn, Kampus Pauh Putra, Arau 02600, Perlis, Malaysia

[2] Univ Malaysia Perlis, Inst Nano Elect Engn INEE, Seriab Kangar 01000, Perlis, Malaysia

来源：

MICRO/NANO SCIENCE AND ENGINEERING | 2014年 / 925卷

关键词：

RIE; DOE; DESIGNED EXPERIMENTS;

D O I：

10.4028/www.scientific.net/AMR.925.84

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Reactive Ion Etching (RIE) is an important process in fabrication of semiconductor devices. Design Of Experiment(DOE) has been used to study the effect of Reactive Ion Etch(RIE) towards surface morphology of aluminum bond pad. Important RIE factors involved in this experimental study are ratio of Tetrafluoromethane (CF4), Argon gas flow, BIAS, and ICP power. Different combinations of these factors produces different results of surface morphologies which was obtained using Atomic Force Microscopic(AFM). Produced results shows that overall surface roughness of the pad is affected by RIE and DOE offers a better way to optimize the desired outcome.

引用

页码：84 / +

页数：2

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