3D packaging of a microsystem with special thermal constraints

被引：0
|
作者：
Morrissey, A [1 ]
Alderman, J [1 ]
Kelly, G [1 ]
Kohári, Z [1 ]
Páhi, A [1 ]
Rencz, M [1 ]
机构：
[1] Natl Univ Ireland Univ Coll Cork, Natl Microelect Res Ctr, Cork, Ireland
来源：
THERMINIC: COLLECTION OF PAPERS PRESENTED AT THE INTERNATIONAL WORKSOP ON THERMAL INVESTIGATIONS OF ICS AND MICROSTRUCTURES | 1998年
关键词：
D O I：
暂无
中图分类号：
TP3 [计算技术、计算机技术];
学科分类号：
0812 ;
摘要：
After presenting the challenges and solutions of the 3D packaging of a medical implant MEMS device the paper presents thermal simulations on the structure. Using this simulation problem as a case study various features of the SUNRED and SYSTUS 3D simulators are compared in the paper.
引用
收藏
页码：171 / 174
页数：4
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