Flip chip on board mounting processes using anisotropic conductive adhesives and eutectic solder

被引：2
|
作者：
Zhong, ZW [1 ]
Wong, S [1 ]
机构：
[1] Gint Inst Mfg Technol, Singapore, Singapore
来源：
2ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS | 1998年
关键词：
D O I：
10.1109/EPTC.1998.755982
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this study, flip chip on board evaluations were carried out using Taguchi's design of experiment. Simple but high yield procedures for reworking flip chip on board using anisotropic conductive adhesives and anisotropic conductive films were developed. Underfill and encapsulation processes for flip chip on board using eutectic solder bumps were also evaluated. The flip chips were assembled on test vehicles for temperature cycling and high-temperature high-humidity tests. The reliability performance of the three processes - gold bumps with anisotropic conductive film, anisotropic conductive adhesive, and eutectic solder with underfill is also discussed in this paper.
引用
收藏
页码：76 / 82
页数：7
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