Development of flip-chip joining technology on flexible circuitry using anisotropically conductive adhesives and eutectic solder

被引：0
|
作者：
Liu, J. [1 ]
Boustedt, K. [1 ]
Lai, Z. [1 ]
机构：
[1] IVF - Swedish Inst of Production, Engineering Research, Molndal, Sweden
来源：
Circuit World | 1996年 / 22卷 / 02期
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学科分类号：
摘要：
Flip chip devices
引用
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页码：19 / 24
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