Direct integration of dielectric all-ceramic thick films on a polymer substrate using room temperature fabrication

被引:4
|
作者
Vaataja, Maria [1 ]
Kahari, Hanna [1 ]
Ohenoja, Katja [2 ]
Juuti, Jari [1 ]
Jantunen, Heli [1 ]
机构
[1] Univ Oulu, Microelect Res Unit, POB 4500, Oulu 90014, Finland
[2] Univ Oulu, Fibre & Particle Engn Res Unit, POB 4300, Oulu 90014, Finland
基金
芬兰科学院; 欧洲研究理事会;
关键词
Low temperature processing; Microwave dielectric properties; Screen printing; Lithium molybdate; Barium titanate; COMPOSITES;
D O I
10.1016/j.jeurceramsoc.2020.04.009
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Direct integration of all-ceramic thick films and a polymer substrate has been realized for the first time without high temperature processing using the Room Temperature Fabrication method. Printable Li2MoO4-BaTiO3 composite pastes with 0, 10, and 20 vol.% of BaTiO3 were fabricated from the respective ceramic powders and water without organic additives or vehicles. The pastes were stencil printed on a polyimide substrate and dried at 120 degrees C without pressing or lamination. Using scanning electron microscopy, the films were observed to be in seamless contact with the substrate and to have a uniform microstructure. Relative permittivities of the ceramic films increased from 4.2 to 7.2 (at 2.5 GHz) and 4.5 to 7.5 (at 9.9 GHz) according to the vol.% content of the added BaTiO3, with corresponding dielectric losses from 10(-3) to 10(-2). The results show that the room temperature fabrication method enables 2D printing of all-ceramic thick films on temperature-sensitive substrates.
引用
收藏
页码:3984 / 3988
页数:5
相关论文
共 50 条
  • [21] Effects of heat treatment on the dielectric properties of aerosol-deposited Al2O3-polyimide composite thick films for room-temperature fabrication
    Kim, Hyung-Jun
    Nam, Song-Min
    JOURNAL OF CERAMIC PROCESSING RESEARCH, 2009, 10 (06): : 817 - 822
  • [22] Wafer bonding using dielectric polymer thin films in 3D integration
    Kwon, Y
    Lu, JQ
    Kraft, RP
    McDonald, JF
    Gutmann, RJ
    Cale, TS
    POLYMER INTERFACES AND THIN FILMS, 2002, 710 : 231 - 236
  • [23] Preparation of Cu films on polymer substrate by ECR-MOCVD coupled with DC bias at room temperature
    Lee, JK
    Cho, BW
    THIN FILM MATERIALS, PROCESSES, AND RELIABILITY: PLASMA PROCESSING FOR THE 100 NM NODE AND COPPER INTERCONNECTS WITH LOW-K INTER-LEVEL DIELECTRIC FILMS, 2003, 2003 (13): : 82 - 92
  • [24] Direct fabrication of aligned metal composite carbon nanofibers on copper substrate at room temperature and their field emission property
    Ghosh, Pradip
    Yusop, M. Zamri
    Ghosh, Debasish
    Hayashi, Akari
    Hayashi, Yasuhiko
    Tanemura, Masaki
    CHEMICAL COMMUNICATIONS, 2011, 47 (16) : 4820 - 4822
  • [25] Wavelength, fluence and substrate-dependent room temperature pulsed laser deposited B-enriched thick films
    Caricato, Anna Paola
    Quarta, Gianluca
    Manno, Daniela
    Cesaria, Maura
    Perrone, Alessio
    Martino, Maurizio
    Serra, Antonio
    Calcagnile, Lucio
    Barone, Giorgio
    Lorusso, Antonella
    APPLIED SURFACE SCIENCE, 2019, 483 : 1044 - 1051
  • [26] Effects of temperature on the multiple cracking progress of sub-micron thick glass films deposited on a polymer substrate
    Yanaka, M
    Kato, Y
    Tsukahara, Y
    Takeda, N
    THIN SOLID FILMS, 1999, 355 : 337 - 342
  • [27] An Effective Method for Fabrication of 3-D Dielectric Materials Using Polymer-Ceramic Composites
    Shi, Y.
    Bhowmik, Lal M.
    Amert, A. K.
    Whites, K. W.
    2014 IEEE ANTENNAS AND PROPAGATION SOCIETY INTERNATIONAL SYMPOSIUM (APSURSI), 2014, : 225 - 226
  • [28] Plasma-activated direct bonding at room temperature to achieve the integration of single-crystalline GaAs and Si substrate
    Huang, Rui
    Lan, Tian
    Li, Chong
    Wang, Zhiyong
    RESULTS IN PHYSICS, 2021, 31
  • [29] Effect of firing temperature on microstructure and dielectric properties of chromium oxide based glass composite thick films on stainless steel substrate
    Shirke, Ghanasham D.
    Umarji, Govind G.
    Tarale, Arjun R.
    Mathe, Vikas L.
    Mulik, Uttam P.
    Rane, Sunit B.
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018, 29 (12) : 9871 - 9878
  • [30] Effect of firing temperature on microstructure and dielectric properties of chromium oxide based glass composite thick films on stainless steel substrate
    Ghanasham D. Shirke
    Govind G. Umarji
    Arjun R. Tarale
    Vikas L. Mathe
    Uttam P. Mulik
    Sunit B. Rane
    Journal of Materials Science: Materials in Electronics, 2018, 29 : 9871 - 9878