Recent developments in high integration multi-standard CMOS transceivers for personal communication systems

被引：0

作者：

Rudell, JC ^{[1
]}

Ou, JJ ^{[1
]}

Narayanaswami, RS ^{[1
]}

Chien, G ^{[1
]}

Weldon, JA ^{[1
]}

Lin, L ^{[1
]}

Tsai, KC ^{[1
]}

Tee, L ^{[1
]}

Khoo, K ^{[1
]}

Au, D ^{[1
]}

Robinson, T ^{[1
]}

Gerna, D ^{[1
]}

Otsuka, M ^{[1
]}

Paul, R ^{[1
]}

机构：

[1] Univ Calif Berkeley, Dept Comp Sci & Elect Engn, Berkeley, CA 94720 USA

来源：

1998 INTERNATIONAL SYMPOSIUM ON LOW POWER ELECTRONICS AND DESIGN - PROCEEDINGS | 1998年

关键词：

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

Issues associated with the integration of transceiver components on to a single silicon substrate are discussed. In particular, recently proposed receiver and transmitter architectures for high integration are examined on the promise of providing multistandard capability, In addition, existing barriers to lower power transceiver operation are examined as well as some proposed directions for future integrated transceiver research and development.

引用

页码：149 / 154

页数：6

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