A new screen printing process with important potential automotive applications

Potential automotive application specific process developments are outlined which use thick polymer Stencils that allow printing of a range of different height deposits at the same time. Ways of using this process for assembly of a. double sided SMT of designs with through-hole components b. double sided designs with surface mount components with a single reflow oven pass. c. relpacement of 'pin-dip' adhesive application so that the newer smaller SMT components can be repeatedly and reliably assembled. d. a simplified, in-line compatible, underfill assembly sequence which utilises screen printing only.