A new screen printing process with important potential automotive applications

被引：0
|
作者：
MacKay, CA [1 ]
机构：
[1] DEK Screen Printers, Portland DT4 7TH, Dorset, England
来源：
TWENTY SECOND IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM, IEMT-EUROPE 1998: ELECTRONICS MANUFACTURING AND DEVELOPMENT FOR AUTOMOTIVES | 1998年
关键词：
D O I：
10.1109/IEMTE.1998.723071
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
Potential automotive application specific process developments are outlined which use thick polymer Stencils that allow printing of a range of different height deposits at the same time. Ways of using this process for assembly of a. double sided SMT of designs with through-hole components b. double sided designs with surface mount components with a single reflow oven pass. c. relpacement of 'pin-dip' adhesive application so that the newer smaller SMT components can be repeatedly and reliably assembled. d. a simplified, in-line compatible, underfill assembly sequence which utilises screen printing only.
引用
收藏
页码：125 / 130
页数：6
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