Reducing the substrate losses of RF integrated inductors

被引：26
|
作者：
Mernyei, F [1 ]
Darrer, F
Pardoen, M
Sibrai, A
机构：
[1] Austria Mikro Syst Int AG, Budapest Design Off, H-1135 Budapest, Hungary
[2] Austria Mikro Syst Int AG, Dept Engn, Schloss Premstatten, A-8141 Unterpremstatten, Austria
来源：
IEEE MICROWAVE AND GUIDED WAVE LETTERS | 1998年 / 8卷 / 09期
关键词：
integrated inductor; on-chip spiral; quality factor; substrate loss;
D O I：
10.1109/75.720461
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This letter introduces a new method for reducing the substrate-related losses of integrated spiral inductors for radio frequency (RF) applications. Measurement based equivalent circuit parameters are demonstrated. Using our method the quality factor increased from 5.3 to 6.0 at 3.5 GHz at an 1.8-nH inductor.
引用
收藏
页码：300 / 301
页数：2
相关论文
共 50 条
  • [21] Modelling and Characterisation of Fractal Based RF Inductors on Silicon Substrate
    Maric, A.
    Radosavljevic, G.
    Zivanov, M.
    Zivanov, L. J.
    Stojanovic, G.
    Mayer, M.
    Jachimowicz, A.
    Keplinger, F.
    ASDAM 2008, CONFERENCE PROCEEDINGS, 2008, : 191 - +
  • [22] Layout design and optimization of RF spiral inductors on silicon substrate
    State Key Laboratory of Integrated Optoelectronics, Institute of Semiconductors, Chinese Academy of Sciences, Beijing 100083, China
    Pan Tao Ti Hsueh Pao, 2006, 5 (769-773):
  • [23] An Improved Calculation of Copper Losses in Integrated Power Inductors on Silicon
    Wang, Ningning
    O'Donnell, Terence
    O'Mathuna, Cian
    IEEE TRANSACTIONS ON POWER ELECTRONICS, 2013, 28 (08) : 3641 - 3647
  • [24] Characterization of Integrated Inductors on Flexible Substrate for Heterogeneous Integration
    Freitas, Wilson
    Carvalho, Nailson
    Souza, Rodrigo
    Manera, Leandro
    2020 IEEE 8TH ELECTRONICS SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2020,
  • [25] Integrated microwave inductors on silicon-on-insulator substrate
    Huynen, I
    Raskin, JP
    Gillon, R
    Vanhoenacker, D
    Colinge, JP
    27TH EUROPEAN MICROWAVE 97, CONFERENCE + EXHIBITION - BRIDGING THE GAP BETWEEN INDUSTRY AND ACADEMIA, VOLS I AND II, 1997, : 1008 - 1013
  • [26] A new approach to characterize substrate losses of on-chip inductors.
    Schimpf, K
    Benna, B
    Proetel, D
    ICMTS 2001: PROCEEDINGS OF THE 2001 INTERNATIONAL CONFERENCE ON MICROELECTRONIC TEST STRUCTURES, 2001, : 115 - 118
  • [27] An analytical model of electric substrate losses for planar spiral inductors on silicon
    Goni, Amaya
    del Pino, Javier
    Gonzalez, Benito
    Hernandez, Antonio
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2007, 54 (03) : 546 - 553
  • [28] Thick microporous silicon isolation layers for integrated RF inductors
    Gautier, G.
    Leduc, P.
    Semai, J.
    Ventura, L.
    PHYSICA STATUS SOLIDI C - CURRENT TOPICS IN SOLID STATE PHYSICS, VOL 5, NO 12 2008, 2008, 5 (12): : 3667 - +
  • [29] Fully integrated ferrite-based inductors for RF ICs
    Yang, C.
    Liu, F.
    Ren, T.
    Liu, L.
    Feng, H.
    Wang, A. Z.
    Long, H.
    SENSORS AND ACTUATORS A-PHYSICAL, 2006, 130 : 365 - 370
  • [30] RF performances at cryogenic temperature of inductors integrated in a FDSOI technology
    Berlingard, Quentin
    Lugo-Alvarez, Jose
    Contamin, Lauriane
    Durand, Cedric
    Galy, Philippe
    Juge, Andre
    De Franceschi, Silvano
    Vinet, Maud
    Meunier, Tristan
    Casse, Mikae
    Gaillard, Fred
    SOLID-STATE ELECTRONICS, 2022, 194
12345