The novel deflector for multi arrayed microcolumn using microelectromechanical system (MEMS) technology

This paper describes a new concept for a multiple arrayed deflector with a reduced amount of wiring by utilizing a fabrication technique using microelectromechanical system (MEMS) technology, such as multi wafer anodic bonding techniques and copper electroplating in order to produce a double layer structure. The double layer interconnection structure is a newly introduced interconnection method that reduces wiring among the components. A 3 x 3 arrayed deflector, which has an internal wiring structure, was fabricated. The deflection performance of the newly fabricated deflector displayed linear deflection results. Moreover, the difference in the signal delay between each deflector pole, which was caused by multiple interconnection structures, was calculated using a simulation program with integrated circuit emphasis (SPICE) simulator with an equivalent circuit model. The calculation results showed there was an approximate 3 ns signal delay difference. Therefore, this method is very useful for checking the difference in the signal delay. This work will be helpful for understanding the interconnections a multiple arrayed microcolumn system.