A highly scalable 3D chip for binary neural network classification applications

被引:0
|
作者
Bermak, A [1 ]
机构
[1] Hong Kong Univ Sci & Technol, Dept Elect & Elect Engn, Kowloon, Hong Kong, Peoples R China
关键词
D O I
暂无
中图分类号
TP18 [人工智能理论];
学科分类号
081104 ; 0812 ; 0835 ; 1405 ;
摘要
This paper describes a 3D VLSI Chip for binary neural network classification applications. The 3D circuit includes three layers of MCM integrating 4 chips each making it a total of 12 chips integrated in a volume of (2 x 2 x 0.7) cm(3). The architecture is scalable, and real-time binary neural network classifier systems could be built with one, two or all twelve chip solutions. Each basic chip includes an on-chip control unit for programming options of the neural network topology and precision. The system is modular and presents easy expansibility without requiring extra devices. Experimental test results showed that a full recall operation is obtained in less than 1.2mus for any topology with 4-bit or 8-bit precision while it is obtained in less than 2.2mus for any 16-it precision. As a consequence the 3D chip is a very powerful reconfigurable and a multiprecision neural chip exhibiting a significant speed of 1.25 GCPS.
引用
收藏
页码:685 / 688
页数:4
相关论文
共 50 条
  • [41] Detection and classification of faults in photovoltaic arrays using a 3D convolutional neural network
    Hong, Ying-Yi
    Pula, Rolando A.
    ENERGY, 2022, 246
  • [42] Automated rotator cuff tear classification using 3D convolutional neural network
    Shim, Eungjune
    Kim, Joon Yub
    Yoon, Jong Pil
    Ki, Se-Young
    Lho, Taewoo
    Kim, Youngjun
    Chung, Seok Won
    SCIENTIFIC REPORTS, 2020, 10 (01)
  • [43] Detailed Analysis of Blink Types Classification Using a 3D Convolutional Neural Network
    Sato H.
    Abe K.
    Matsuno S.
    Ohyama M.
    IEEJ Transactions on Electronics, Information and Systems, 2023, 143 (09) : 971 - 978
  • [44] Neural network classification of aggregates by means of line laser based 3D acquisition
    Sinecen, Mahmut
    Topal, Ali
    Makinaci, Metehan
    Baradan, Bulent
    EXPERT SYSTEMS, 2013, 30 (04) : 333 - 340
  • [45] Compressive hyperspectral image classification using a 3D coded convolutional neural network
    Zhang, Hao
    Ma, Xu
    Zhao, Xianhong
    Arce, Gonzalo R.
    OPTICS EXPRESS, 2021, 29 (21): : 32875 - 32891
  • [46] SplineNet: B-spline neural network for efficient classification of 3D data
    Jinka, Sai Sagar
    Sharma, Avinash
    ELEVENTH INDIAN CONFERENCE ON COMPUTER VISION, GRAPHICS AND IMAGE PROCESSING (ICVGIP 2018), 2018,
  • [47] DEEP LEARNING ON POINT CLOUD FOR 3D CLASSIFICATION BASED ON SPIKING NEURAL NETWORK
    Zhang Silin
    2022 19TH INTERNATIONAL COMPUTER CONFERENCE ON WAVELET ACTIVE MEDIA TECHNOLOGY AND INFORMATION PROCESSING (ICCWAMTIP), 2022,
  • [48] Automated rotator cuff tear classification using 3D convolutional neural network
    Eungjune Shim
    Joon Yub Kim
    Jong Pil Yoon
    Se-Young Ki
    Taewoo Lho
    Youngjun Kim
    Seok Won Chung
    Scientific Reports, 10
  • [49] A novel neural network-based 3D animation model classification method
    Shi, Ximan
    INTERNATIONAL JOURNAL OF COMPUTER APPLICATIONS IN TECHNOLOGY, 2023, 71 (03) : 222 - 228
  • [50] Classification of MRI Migraine Medical Data Using 3D Convolutional Neural Network
    Ng, Hwei Geok
    Kerzel, Matthias
    Mehnert, Jan
    May, Arne
    Wermter, Stefan
    ARTIFICIAL NEURAL NETWORKS AND MACHINE LEARNING - ICANN 2018, PT III, 2018, 11141 : 300 - 309