Flip chin interconnection of DNA chip devices

被引:0
|
作者
LeClair, T [1 ]
Harper, A [1 ]
Graham, S [1 ]
Ackley, D [1 ]
机构
[1] Nanogen Inc, San Diego, CA 92121 USA
关键词
gene chips; flip chip interconnects; Ag adhesive bumps; Sn/Pb solder bumps; fine line polyimide flex circuits; fluidic interfaces to Si chips;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Nanogen has developed a novel instrument system that utilizes silicon microelectronic technologies to execute rapid DNA hybridization analyses optimized for diagnostic and research applications. This system incorporates an active DNA away-formatted Si microchip, that is flip-chip mounted to a polyimide flex circuit microfluidic cartridge assembly. This disposable cartridge assembly is inserted for analysis into Nanogen's desktop instrument much like a music CD enters the CD player drawer. Multiplex DNA hybridization, electronic control of hybridization stringency, sample detection, and computer analysis functions can be automatically performed within a 10 to 15 minute timeframe. Present applications are directed at infectious disease detection, genetic testing, drug discovery, and biomedical research. The microelectronic materials and processes selected for the DNA chip, the interconnection circuits, the cartridge fluidics, and the optical detection system will be presented.
引用
收藏
页码:732 / 736
页数:3
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