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- [22] Flip chip interconnection method applied to small camera module 51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 1024 - 1028
- [23] Thermosonic flip chip interconnection using electroplated copper column arrays IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2006, 29 (04): : 725 - 734
- [25] Resin flow characteristics of underfill encapsulant for flip-chip interconnection IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2003, 26 (01): : 268 - 274
- [26] Reliability investigation for encapsulated isotropic conductive adhesives flip chip interconnection PROCEEDINGS OF THE SIXTH IEEE CPMT CONFERENCE ON HIGH DENSITY MICROSYSTEM DESIGN AND PACKAGING AND COMPONENT FAILURE ANALYSIS (HDP'04), 2004, : 134 - 140
- [27] Characterization of Flip-Chip Interconnection for High Speed Digital Transmission 2015 ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY (APEMC), 2015, : 498 - 501
- [28] Novel flip-chip interconnection technology for millimeter wave applications 58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS, 2008, : 1978 - 1983
- [30] High frequency thermosonic flip chip bonding for gold to gold interconnection 54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 1461 - 1465