Trends in Fan Out Wafer Level Packaging

被引：6
|
作者：
Theuss, Horst [1 ]
Geissler, Christian [1 ]
Hartner, Walter [1 ]
机构：
[1] Infineon Technol AG, Wernerwerkstr 2, D-93049 Regensburg, Germany
来源：
2020 13TH INTERNATIONAL CONFERENCE ON ADVANCED SEMICONDUCTOR DEVICES AND MICROSYSTEMS (ASDAM 2020) | 2020年
关键词：
D O I：
10.1109/ASDAM50306.2020.9393840
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
This paper gives an overview on current major development fields related with Fan Out Wafer Level Packaging (FOWLP). Three novel developments are particularly highlighted and presented in detail: Integration of MEMS into FOWLP, improvements in board level reliability and package features adding to the RF-performance of the device.
引用
收藏
页码：106 / 110
页数：5
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