Chip-package codesign of receiver front end modules for RF/wireless applications

被引：0
|
作者：
Amin, Y [1 ]
Tenhunen, H [1 ]
Jamal, H [1 ]
Zheng, LR [1 ]
Duo, XZ [1 ]
机构：
[1] Royal Inst Technol, Stockholm, Sweden
来源：
2005 IEEE/ACES International Conference on Wireless Communications and Applied Computational Electromagnetics | 2005年
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：767 / 770
页数：4
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