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- [31] ELECTRICAL MODELING PROGRAM FOR HIGH-PERFORMANCE IC PACKAGING - THE STUDY OF LOGIC-CIRCUIT BEHAVIOR (PROPAGATION DELAY, RISE TIME, AND FALL TIME) WITH RESPECT TO DELTA-I NOISE PROCEEDINGS OF THE TECHNICAL CONFERENCE : NINTH ANNUAL INTERNATIONAL ELECTRONICS PACKAGING CONFERENCE, VOLS 1 AND 2, 1989, : 359 - 366
- [32] Modeling and Measurement of Board-level ESD from Power/Ground Plane Charged by Low-voltage for Investigation of Decoupling Capacitor Effects in Printed Circuit Boards (PCBs) 2010 12TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2010, : 773 - 776