Highly Conductive 3D Printable Materials for 3D Structural Electronics

被引:22
|
作者
Baker, Daina, V [1 ]
Bao, Chao [2 ]
Kim, Woo Soo [2 ]
机构
[1] Simon Fraser Univ, Sch Sustainable Energy Engn, Surrey, BC V3T 0A3, Canada
[2] Simon Fraser Univ, Sch Mechatron Syst Engn, Surrey, BC V3T 0A3, Canada
基金
加拿大自然科学与工程研究理事会;
关键词
3D printing; structural electronics; 3D printable conductor; printed electronics; conductive ink; conductive filament; COPPER NANOPARTICLES; REDUCTION; INK; MICROFABRICATION; OXIDATION; CIRCUITS; PATTERNS; METALS;
D O I
10.1021/acsaelm.1c00296
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
3D printing will be one of the key technologies in the next industrial revolution. It will usher us into an era of decentralized manufacturing, empowering individuals to manufacture in their communities. One area in particular that can benefit from 3D printing is the production of electronics. 3D printing allows for the fabrication of structural electronics, which have their components embedded in the 3D structured object. Recently spotlighted 3D structural printing technologies include fused filament fabrication and direct-ink writing to prepare 3D conductive traces. Highly conductive traces are imperative for achieving reliable 3D structural electronics. This Spotlight will overview highly conductive 3D printable materials available from several prominent methods of producing conductive traces. Key conducting materials demonstrated by 3D deposition, photocuring, and electrochemical approaches have been reviewed and discussed.
引用
收藏
页码:2423 / 2433
页数:11
相关论文
共 50 条
  • [31] 3D Printed Electronics
    Ready, Steven
    Endicott, Fred
    Whiting, Gregory L.
    Ng, Tse Nga
    Chow, Eugene M.
    Lu, JengPing
    NIP29: 29TH INTERNATIONAL CONFERENCE ON DIGITAL PRINTING TECHNOLOGIES / DIGITAL FABRICATION 2013, 2013, : 9 - 12
  • [32] A 3D Printable Hand Exoskeleton for the Haptic Exploration of Virtual 3D Scenes
    Goetzelmann, Timo
    10TH ACM INTERNATIONAL CONFERENCE ON PERVASIVE TECHNOLOGIES RELATED TO ASSISTIVE ENVIRONMENTS (PETRA 2017), 2017, : 63 - 66
  • [33] Mathematical approach to design 3D scaffolds for the 3D printable bone implant
    Wojnicz, Wiktoria
    Augustyniak, Marek
    Borzyszkowski, Piotr
    BIOCYBERNETICS AND BIOMEDICAL ENGINEERING, 2021, 41 (02) : 667 - 678
  • [34] Development of Highly Energy Densified Ink for 3D Printable Batteries
    Park, Sujin
    Nenov, Nenko S.
    Ramachandran, Arathi
    Chung, Kyeongwoon
    Hoon Lee, Sea
    Yoo, Jungjoon
    Yeo, Jeong-gu
    Bae, Chang-Jun
    ENERGY TECHNOLOGY, 2018, 6 (10) : 2058 - 2064
  • [35] 3D Printable Electrically Conductive Hydrogel Scaffolds for Biomedical Applications: A Review
    Athukorala, Sandya Shiranthi
    Tran, Tuan Sang
    Balu, Rajkamal
    Truong, Vi Khanh
    Chapman, James
    Dutta, Naba Kumar
    Roy Choudhury, Namita
    POLYMERS, 2021, 13 (03) : 1 - 21
  • [36] Recent advances in 3D printable conductive hydrogel inks for neural engineering
    Sung Dong Kim
    Kyoungryong Kim
    Mikyung Shin
    Nano Convergence, 10
  • [37] Recent advances in 3D printable conductive hydrogel inks for neural engineering
    Yuan, Chengyun
    Li, Qun
    Dong, Yunfa
    Wang, Jiayu
    He, Weidong
    Yan, Cenqi
    Wang, Yinghan
    Cheng, Pei
    NANO CONVERGENCE, 2023, 10 (01)
  • [38] Feasibility study of developing cementless blended materials as 3D printable materials
    Fiala, Lukas
    Lin, Wei-Ting
    Hotek, Petr
    Cheng, An
    CASE STUDIES IN CONSTRUCTION MATERIALS, 2023, 19
  • [39] Influence of Supplementary Cementitious Materials on Fresh Properties of 3D Printable Materials
    Teixeira, Joao
    Schaefer, Cecilia Ogliari
    Maia, Lino
    Rangel, Barbara
    Neto, Rui
    Alves, Jorge Lino
    SUSTAINABILITY, 2022, 14 (07)
  • [40] Mechanical Characterization and Constitutive Modeling of 3D Printable Soft Materials
    Smith, Lawrence
    MacCurdy, Robert
    3D PRINTING AND ADDITIVE MANUFACTURING, 2024, 11 (03) : e1209 - e1212